GIA: A Reusable General Interposer Architecture for Agile Chiplet Integration

2.5D chiplet technology is gaining popularity for the efficiency of integrating multiple heterogeneous dies or chiplets on interposers, and it is also considered an ideal option for agile silicon system design by mitigating the huge design, verification, and manufacturing overhead of monolithic SoCs....

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Bibliographic Details

Published in:	2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD) pp. 1 - 9
Main Authors:	Li, Fuping, Wang, Ying, Cheng, Yuanqing, Wang, Yujie, Han, Yinhe, Li, Huawei, Li, Xiaowei
Format:	Conference Proceeding
Language:	English
Published:	ACM 29.10.2022
Subjects:	2.5D integration chiplet interposer network-on-chip reusability
ISSN:	1558-2434
Online Access:	Get full text
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