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MLA-Zitierstil (9. Ausg.)Li, Fuping, et al. "GIA: A Reusable General Interposer Architecture for Agile Chiplet Integration." 2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD), 29 Oct. 2022, pp. 1-9, https://doi.org/10.1145/3508352.3549464.