Li, F., Wang, Y., Cheng, Y., Wang, Y., Han, Y., Li, H., & Li, X. (2022, October 29). GIA: A Reusable General Interposer Architecture for Agile Chiplet Integration. 2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD), 1-9. https://doi.org/10.1145/3508352.3549464
Citácia podle Chicago (17th ed.)Li, Fuping, Ying Wang, Yuanqing Cheng, Yujie Wang, Yinhe Han, Huawei Li, a Xiaowei Li. "GIA: A Reusable General Interposer Architecture for Agile Chiplet Integration." 2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD) 29 Oct. 2022: 1-9. https://doi.org/10.1145/3508352.3549464.
Citácia podľa MLA (8th ed.)Li, Fuping, et al. "GIA: A Reusable General Interposer Architecture for Agile Chiplet Integration." 2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD), 29 Oct. 2022, pp. 1-9, https://doi.org/10.1145/3508352.3549464.