2022 ICCAD CAD Contest Problem B: 3D Placement with D2D Vertical Connections
In the chiplet era, the benefits from multiple factors can be observed by splitting a large single die into multiple small dies. By having the multiple small dies with die-to-die (D2D) vertical connections, the benefits including: 1) better yield, 2) better timing/performance, and 3) better cost. Ho...
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| Vydáno v: | 2022 IEEE/ACM International Conference On Computer Aided Design (ICCAD) s. 1 - 5 |
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| Hlavní autoři: | , , , , , |
| Médium: | Konferenční příspěvek |
| Jazyk: | angličtina |
| Vydáno: |
ACM
29.10.2022
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| Témata: | |
| ISSN: | 1558-2434 |
| On-line přístup: | Získat plný text |
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| Abstract | In the chiplet era, the benefits from multiple factors can be observed by splitting a large single die into multiple small dies. By having the multiple small dies with die-to-die (D2D) vertical connections, the benefits including: 1) better yield, 2) better timing/performance, and 3) better cost. How to do the netlist partitioning, cell placement in each of the small dies, and also how to determine the location of the D2D inter-connection terminals becomes a new topic.To address this chiplet era physical implementation problem, ICCAD-2022 contest encourages the research in the techniques of multi-die netlist partitioning and placement with D2D vertical connections. We provided (i) a set of benchmarks and (ii) an evaluation metric that facilitate contestants to develop, test, and evaluate their new algorithms. |
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| AbstractList | In the chiplet era, the benefits from multiple factors can be observed by splitting a large single die into multiple small dies. By having the multiple small dies with die-to-die (D2D) vertical connections, the benefits including: 1) better yield, 2) better timing/performance, and 3) better cost. How to do the netlist partitioning, cell placement in each of the small dies, and also how to determine the location of the D2D inter-connection terminals becomes a new topic.To address this chiplet era physical implementation problem, ICCAD-2022 contest encourages the research in the techniques of multi-die netlist partitioning and placement with D2D vertical connections. We provided (i) a set of benchmarks and (ii) an evaluation metric that facilitate contestants to develop, test, and evaluate their new algorithms. |
| Author | Shen, Chin-Fang Cindy Lin, I-Jye Wu, Yi-Hsuan Hu, Kai-Shun Huang, Yu-Hui Chi, Hao-Yu |
| Author_xml | – sequence: 1 givenname: Kai-Shun surname: Hu fullname: Hu, Kai-Shun email: kaihu@synopsys.com organization: Synopsys, Inc.,Taipei,Taiwan – sequence: 2 givenname: I-Jye surname: Lin fullname: Lin, I-Jye email: ijlin@synopsys.com organization: Synopsys, Inc.,Taipei,Taiwan – sequence: 3 givenname: Yu-Hui surname: Huang fullname: Huang, Yu-Hui email: yuhui@synopsys.com organization: Synopsys, Inc.,Taipei,Taiwan – sequence: 4 givenname: Hao-Yu surname: Chi fullname: Chi, Hao-Yu email: haoyuchi@synopsys.com organization: Synopsys, Inc.,Taipei,Taiwan – sequence: 5 givenname: Yi-Hsuan surname: Wu fullname: Wu, Yi-Hsuan email: wualice@synopsys.com organization: Synopsys, Inc.,Taipei,Taiwan – sequence: 6 givenname: Chin-Fang Cindy surname: Shen fullname: Shen, Chin-Fang Cindy email: cfshen@synopsys.com organization: Synopsys, Inc.,Taipei,Taiwan |
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| Snippet | In the chiplet era, the benefits from multiple factors can be observed by splitting a large single die into multiple small dies. By having the multiple small... |
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| SubjectTerms | 3DIC Benchmark testing Computer architecture Costs Design automation Measurement Microprocessors Physical design placement Three-dimensional displays |
| Title | 2022 ICCAD CAD Contest Problem B: 3D Placement with D2D Vertical Connections |
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