DAGON: technology binding and local optimization by DAG matching

Technology binding is the process of mapping a technology independent description of a circuit into a particular technology. This paper outlines a formalism of this problem and offers a solution to the problem in terms of matching patterns, describing technology specific cells and optimizations, aga...

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Bibliographic Details
Published in:24th ACM/IEEE Design Automation Conference pp. 341 - 347
Main Author: Keutzer, K.
Format: Conference Proceeding
Language:English
Published: New York, NY, USA ACM 01.10.1987
Series:ACM Conferences
Subjects:
Applied computing > Arts and humanities > Architecture (buildings) > Computer-aided design
Applied computing > Physical sciences and engineering > Engineering > Computer-aided design
Circuit synthesis
Computer languages
Computer systems organization > Dependable and fault-tolerant systems and networks
General and reference > Cross-computing tools and techniques > Performance
Hardware > Electronic design automation > Physical design (EDA)
Libraries
Logic programming
Networks > Network performance evaluation
Optimal matching
Optimizing compilers
Pattern matching
Permission
Program processors
Tree graphs
ISBN:9780818607813, 0818607815
ISSN:0738-100X
Online Access:Get full text
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Summary:Technology binding is the process of mapping a technology independent description of a circuit into a particular technology. This paper outlines a formalism of this problem and offers a solution to the problem in terms of matching patterns, describing technology specific cells and optimizations, against a technology independent circuit represented as a directed acyclic graph. This solution is implemented in DAGON. DAGON rests on a firm algorithmic foundation, and is able to guarantee locally optimal matches against a set of over three thousand patterns. DAGON is an integral part of a synthesis system that has been found to provide industrial quality solutions to real circuit design problems.
ISBN:9780818607813
0818607815
ISSN:0738-100X
DOI:10.1145/37888.37940