SDM-PEB: Spatial-Depthwise Mamba for Enhanced Post-Exposure Bake Simulation

The post-exposure bake (PEB) process is a critical step in semiconductor lithography, directly impacting resist profile accuracy and circuit pattern fidelity. Precise modeling of PEB is essential for controlling photoacid diffusion and inhibitor reactions. In this paper, we introduce SDM-PEB, an adv...

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Bibliographic Details

Published in:	2025 62nd ACM/IEEE Design Automation Conference (DAC) pp. 1 - 7
Main Authors:	Yu, Ziyang, Xu, Peng, Wang, Zixiao, Zhu, Binwu, Wang, Qipan, Lin, Yibo, Wang, Runsheng, Yu, Bei, Wong, Martin
Format:	Conference Proceeding
Language:	English
Published:	IEEE 22.06.2025
Subjects:	Accuracy Feature extraction Inhibitors Integrated circuit modeling Lithography Resists Sensitivity Software Solid modeling Three-dimensional displays
Online Access:	Get full text
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