SDM-PEB: Spatial-Depthwise Mamba for Enhanced Post-Exposure Bake Simulation

The post-exposure bake (PEB) process is a critical step in semiconductor lithography, directly impacting resist profile accuracy and circuit pattern fidelity. Precise modeling of PEB is essential for controlling photoacid diffusion and inhibitor reactions. In this paper, we introduce SDM-PEB, an adv...

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Veröffentlicht in:	2025 62nd ACM/IEEE Design Automation Conference (DAC) S. 1 - 7
Hauptverfasser:	Yu, Ziyang, Xu, Peng, Wang, Zixiao, Zhu, Binwu, Wang, Qipan, Lin, Yibo, Wang, Runsheng, Yu, Bei, Wong, Martin
Format:	Tagungsbericht
Sprache:	Englisch
Veröffentlicht:	IEEE 22.06.2025
Schlagworte:	Accuracy Feature extraction Inhibitors Integrated circuit modeling Lithography Resists Sensitivity Software Solid modeling Three-dimensional displays
Online-Zugang:	Volltext
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