Chen, Z., & Gupta, P. (2025, June 22). YAP: Yield Modeling and Simulation for Advanced Packaging. 2025 62nd ACM/IEEE Design Automation Conference (DAC), 1-7. https://doi.org/10.1109/DAC63849.2025.11132483
Citace podle Chicago (17th ed.)Chen, Zhichao, a Puneet Gupta. "YAP: Yield Modeling and Simulation for Advanced Packaging." 2025 62nd ACM/IEEE Design Automation Conference (DAC) 22 Jun. 2025: 1-7. https://doi.org/10.1109/DAC63849.2025.11132483.
Citace podle MLA (9th ed.)Chen, Zhichao, a Puneet Gupta. "YAP: Yield Modeling and Simulation for Advanced Packaging." 2025 62nd ACM/IEEE Design Automation Conference (DAC), 22 Jun. 2025, pp. 1-7, https://doi.org/10.1109/DAC63849.2025.11132483.
Upozornění: Tyto citace jsou generovány automaticky. Nemusí být zcela správně podle citačních pravidel..