APA (7th ed.) Citation

Sun, Z., Tong, W., Ma, X., Cao, H., Liu, J., Li, Z., & Xu, Q. (2025, June 22). ChipletEM: Physics-Based 2.5D and 3D Chiplet Heterogeneous Integration Electromigration Signoff Tool Using Coupled Stress and Thermal Simulation. 2025 62nd ACM/IEEE Design Automation Conference (DAC), 1-7. https://doi.org/10.1109/DAC63849.2025.11132600

Chicago Style (17th ed.) Citation

Sun, Zeyu, Weijie Tong, Xiaoning Ma, He Cao, Jianyun Liu, Zhiqiang Li, and Qinzhi Xu. "ChipletEM: Physics-Based 2.5D and 3D Chiplet Heterogeneous Integration Electromigration Signoff Tool Using Coupled Stress and Thermal Simulation." 2025 62nd ACM/IEEE Design Automation Conference (DAC) 22 Jun. 2025: 1-7. https://doi.org/10.1109/DAC63849.2025.11132600.

MLA (9th ed.) Citation

Sun, Zeyu, et al. "ChipletEM: Physics-Based 2.5D and 3D Chiplet Heterogeneous Integration Electromigration Signoff Tool Using Coupled Stress and Thermal Simulation." 2025 62nd ACM/IEEE Design Automation Conference (DAC), 22 Jun. 2025, pp. 1-7, https://doi.org/10.1109/DAC63849.2025.11132600.