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Chicago-Zitierstil (17. Ausg.)Sun, Zeyu, Weijie Tong, Xiaoning Ma, He Cao, Jianyun Liu, Zhiqiang Li, und Qinzhi Xu. "ChipletEM: Physics-Based 2.5D and 3D Chiplet Heterogeneous Integration Electromigration Signoff Tool Using Coupled Stress and Thermal Simulation." 2025 62nd ACM/IEEE Design Automation Conference (DAC) 22 Jun. 2025: 1-7. https://doi.org/10.1109/DAC63849.2025.11132600.
MLA-Zitierstil (9. Ausg.)Sun, Zeyu, et al. "ChipletEM: Physics-Based 2.5D and 3D Chiplet Heterogeneous Integration Electromigration Signoff Tool Using Coupled Stress and Thermal Simulation." 2025 62nd ACM/IEEE Design Automation Conference (DAC), 22 Jun. 2025, pp. 1-7, https://doi.org/10.1109/DAC63849.2025.11132600.