Self-Attention to Operator Learning-based 3D-IC Thermal Simulation

Thermal management in 3D ICs is increasingly challenging due to higher power densities. Traditional PDESolving based methods, while accurate, are too slow for iterative design. Machine learning approaches like FNO provide faster alternatives but suffer from high-frequency information loss and high-f...

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Bibliographic Details

Published in:	2025 62nd ACM/IEEE Design Automation Conference (DAC) pp. 1 - 7
Main Authors:	Huang, Zhen, Wang, Hong, Yang, Wenkai, Tang, Muxi, Xie, Depeng, Lin, Ting-Jung, Zhang, Yu, Xing, Wei W., He, Lei
Format:	Conference Proceeding
Language:	English
Published:	IEEE 22.06.2025
Subjects:	Accuracy Computational modeling Fourier Neural Operator Integrated circuit modeling Self-Attention Solid modeling Thermal analysis Thermal expansion Thermal management Thermal modeling Three-dimensional displays Training Transfer learning
Online Access:	Get full text
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