Invited: EDA for Heterogeneous Integration

The advent of heterogeneous integration (HI) places new demands on EDA tooling. Building large systems requires (1) methods for chiplet disaggregation that map the system to smaller chiplets, working in conjunction with system-technology co-optimization to determine the right design decisions that o...

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Veröffentlicht in:	2025 62nd ACM/IEEE Design Automation Conference (DAC) S. 1 - 4
Hauptverfasser:	Haque, Emad, Nalla, Pragnya, Sudarshan, Chetan Choppali, Yogi, Divya, Zhang, Hangyu, Chakrabarti, Chaitali, Chhabria, Vidya A., Harjani, Ramesh, Zhang, Jeff, Sapatnekar, Sachin S.
Format:	Tagungsbericht
Sprache:	Englisch
Veröffentlicht:	IEEE 22.06.2025
Schlagworte:	Chiplets Design automation disaggregation Heterogeneous integration Multichip modules Multiphysics Physical design power delivery Routing Substrates Thermal management Thermomechanical processes
Online-Zugang:	Volltext
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