Challenges on designing electrostatic discharge protection solutions for low power electronics

Electrostatic discharge (ESD) is a process in which a finite amount of charge is transferred from one object (i.e., human body) to the other (i.e., microchip). This process can result in a very high current passing through the object within a very short period of time [1-2]. When a microchip or elec...

Celý popis

Uložené v:
Podrobná bibliografia
Vydané v:Proceedings of the 2013 International Symposium on Low Power Electronics and Design s. 248
Hlavný autor: Liou, Juin J.
Médium: Konferenčný príspevok..
Jazyk:English
Vydavateľské údaje: Piscataway, NJ, USA IEEE Press 04.09.2013
Edícia:ACM Conferences
Predmet:
ISBN:1479912352, 9781479912353
On-line prístup:Získať plný text
Tagy: Pridať tag
Žiadne tagy, Buďte prvý, kto otaguje tento záznam!
Abstract Electrostatic discharge (ESD) is a process in which a finite amount of charge is transferred from one object (i.e., human body) to the other (i.e., microchip). This process can result in a very high current passing through the object within a very short period of time [1-2]. When a microchip or electronic system is subject to an ESD event, the huge ESD-induced current can likely damage the microchip and cause malfunction to the electronic system if the heat generated in the object cannot be dissipated quickly enough. It is estimated that about 35% of all damaged microchips are ESD related, resulting in a revenue loss of several hundred million dollars in the global semiconductor industry every year [3]. The continuing diminishing in the size of MOS devices makes the ESD-induced failures even more prominent, and one can predict with certainty that the availability of effective and robust ESD protection solutions will become a critical component to the successful development of the CMOS-based integrated circuits [4-7].
AbstractList Electrostatic discharge (ESD) is a process in which a finite amount of charge is transferred from one object (i.e., human body) to the other (i.e., microchip). This process can result in a very high current passing through the object within a very short period of time [1-2]. When a microchip or electronic system is subject to an ESD event, the huge ESD-induced current can likely damage the microchip and cause malfunction to the electronic system if the heat generated in the object cannot be dissipated quickly enough. It is estimated that about 35% of all damaged microchips are ESD related, resulting in a revenue loss of several hundred million dollars in the global semiconductor industry every year [3]. The continuing diminishing in the size of MOS devices makes the ESD-induced failures even more prominent, and one can predict with certainty that the availability of effective and robust ESD protection solutions will become a critical component to the successful development of the CMOS-based integrated circuits [4-7].
Author Liou, Juin J.
Author_xml – sequence: 1
  givenname: Juin J.
  surname: Liou
  fullname: Liou, Juin J.
  email: liou@eecs.ucf.edu
  organization: University of Central Florida, Orlando, Florida
BookMark eNqNkD1PwzAQhi0BErR0ZvXIkmLHX_GIIqBIlVhgJbKdc2oIdhUH9e-TiLBzy3vSPXfSPSt0HlMEhG4o2Yqp7krJKymr7ZyK0TO0olxpTUsmyku0yfmDEEKVElzwK_ReH0zfQ-wg4xRxCzl0McQOQw9uHFIezRgcbkN2BzN0gI9DGqdJmOCc-u-5ydinAffphI_pBMPfagwuX6MLb_oMmyXX6O3x4bXeFfuXp-f6fl8YKtRYCG6ZVFx7KQxtJeMgCSWtA0WEYtZX2loNrpr-84oZ7ZmkkmpnJJNWOcrW6Pb3rnFfjU3pMzeUNLOPZvHRLD4mdPtPtLFDAM9-AAecZQs
ContentType Conference Proceeding
DOI 10.5555/2648668.2648731
DatabaseTitleList
DeliveryMethod fulltext_linktorsrc
Discipline Engineering
EndPage 248
GroupedDBID 6IE
6IF
6IK
6IL
6IN
AAJGR
ALMA_UNASSIGNED_HOLDINGS
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CBEJK
IEGSK
IERZE
OCL
RIE
RIL
ID FETCH-LOGICAL-a157t-54b36749f65a1d634e6010dce70573bf89bb9ec8555f73a9f361619ca636b7c13
ISBN 1479912352
9781479912353
ISICitedReferencesCount 0
ISICitedReferencesURI http://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=Summon&SrcAuth=ProQuest&DestLinkType=CitingArticles&DestApp=WOS_CPL&KeyUT=000337238700043&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D
IngestDate Wed Jan 31 06:50:53 EST 2024
IsPeerReviewed false
IsScholarly true
Language English
LinkModel OpenURL
MeetingName ISLPED'13: International Symposium on Low Power Electronics and Design
MergedId FETCHMERGED-LOGICAL-a157t-54b36749f65a1d634e6010dce70573bf89bb9ec8555f73a9f361619ca636b7c13
PageCount 1
ParticipantIDs acm_books_10_5555_2648668_2648731
acm_books_10_5555_2648668_2648731_brief
PublicationCentury 2000
PublicationDate 20130904
PublicationDateYYYYMMDD 2013-09-04
PublicationDate_xml – month: 09
  year: 2013
  text: 20130904
  day: 04
PublicationDecade 2010
PublicationPlace Piscataway, NJ, USA
PublicationPlace_xml – name: Piscataway, NJ, USA
PublicationSeriesTitle ACM Conferences
PublicationTitle Proceedings of the 2013 International Symposium on Low Power Electronics and Design
PublicationYear 2013
Publisher IEEE Press
Publisher_xml – name: IEEE Press
SSID ssj0001775454
ssj0001456121
Score 1.8456229
Snippet Electrostatic discharge (ESD) is a process in which a finite amount of charge is transferred from one object (i.e., human body) to the other (i.e., microchip)....
SourceID acm
SourceType Publisher
StartPage 248
SubjectTerms Applied computing -- Physical sciences and engineering -- Electronics
Hardware -- Hardware test
Hardware -- Hardware validation
Hardware -- Robustness
Title Challenges on designing electrostatic discharge protection solutions for low power electronics
WOSCitedRecordID wos000337238700043&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwtV1bS8MwFA5TfNAnr3gnguCDVK1Jk-ZZFJEpghd8sjRpCgPXid1E_73npGm7DUF9cA_dko0emi9LzknyfYeQfZvpNNInNuAyRVHtXAdxdKqCXGqdhWlomct1-NiVNzfx05O67XTuai7M-4ssivjjQ73-K9RQB2AjdfYPcDc3hQr4DKDDFWCH65RH_O3kc9tUlvX-P8y-bGrp7-6zj8e1Rn3cLOgiHQ6zpR2eN0lxSn9GuT3f4dUM6uQrbpshc9_jaoNPp4P8pJ7BbR8nwYQsLKcDgZ2seWx3tPEFjL46o20mnsa_7_YGo4oz0isOr46qoQ8lmUvoO9djNMWJVQvMIIF7MBOR7MQhE4hnQy7BWT1llaJtPaBWOpx-bval6WE_ghcyWwSPhYiP8F0it35GypOK0tcuu6HD6D0WV0YFwIg7yl9tvlYC82VWKUKhkeMpE-jSmP6YQ3K_SFbbNqAt5EukY4tlsjCmMrlCnlvM6KCgDWZ0AjPaYEZbzGiDGQXMKGBGHWZ0DLNV8nBxfn92Gfi0GkEaRnIYRFwzIbnKRZSGmWDcYlCeGStRHFPnsdJaWRPD8-aSpSpnAsICZVLBhJYmZGtkthgUdp1QmUE8wIzJbMS5UFJnNodRXoObrpDft0H2oH0S_HeUCYSb2IaJb8PEt-EGOfjxN4mGHpZv_uJuW2S-7W7bZHb4NrI7ZM68D3vl267rC18NTWvf
linkProvider IEEE
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=Proceedings+of+the+2013+International+Symposium+on+Low+Power+Electronics+and+Design&rft.atitle=Challenges+on+designing+electrostatic+discharge+protection+solutions+for+low+power+electronics&rft.au=Liou%2C+Juin+J.&rft.series=ACM+Conferences&rft.date=2013-09-04&rft.pub=IEEE+Press&rft.isbn=1479912352&rft.spage=248&rft.epage=248&rft_id=info:doi/10.5555%2F2648668.2648731
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781479912353/lc.gif&client=summon&freeimage=true
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781479912353/mc.gif&client=summon&freeimage=true
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781479912353/sc.gif&client=summon&freeimage=true