A multilevel analytical placement for 3D ICs

In this paper we propose a multilevel non-linear programming based 3D placement approach that minimizes a weighted sum of total wirelength and TS via number subject to area density constraints. This approach relaxes the discrete layer assignments so that they are continuous in the z-direction and th...

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Bibliographic Details
Published in:	Proceedings of the 2009 Asia and South Pacific Design Automation Conference pp. 361 - 366
Main Authors:	Cong, Jason, Luo, Guojie
Format:	Conference Proceeding
Language:	English
Published:	Piscataway, NJ, USA IEEE Press 19.01.2009
Series:	ACM Conferences
Subjects:	Information systems Information systems > Data management systems Information systems > Data management systems > Database administration Information systems > Data management systems > Database administration > Data dictionaries Theory of computation Theory of computation > Design and analysis of algorithms Theory of computation > Design and analysis of algorithms > Mathematical optimization
ISBN:	9781424427482, 1424427487
Online Access:	Get full text
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