A multilevel analytical placement for 3D ICs

In this paper we propose a multilevel non-linear programming based 3D placement approach that minimizes a weighted sum of total wirelength and TS via number subject to area density constraints. This approach relaxes the discrete layer assignments so that they are continuous in the z-direction and th...

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Vydáno v:Proceedings of the 2009 Asia and South Pacific Design Automation Conference s. 361 - 366
Hlavní autoři: Cong, Jason, Luo, Guojie
Médium: Konferenční příspěvek
Jazyk:angličtina
Vydáno: Piscataway, NJ, USA IEEE Press 19.01.2009
Edice:ACM Conferences
Témata:
Information systems
Information systems > Data management systems
Information systems > Data management systems > Database administration
Information systems > Data management systems > Database administration > Data dictionaries
Theory of computation
Theory of computation > Design and analysis of algorithms
Theory of computation > Design and analysis of algorithms > Mathematical optimization
ISBN:9781424427482, 1424427487
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Abstract In this paper we propose a multilevel non-linear programming based 3D placement approach that minimizes a weighted sum of total wirelength and TS via number subject to area density constraints. This approach relaxes the discrete layer assignments so that they are continuous in the z-direction and the problem can be solved by an analytical global placer. A key idea is to do the overlap removal and device layer assignment simultaneously by adding a density penalty function for both area & TS via density constraints. Experimental results show that this analytical placer in a multilevel framework is effective to achieve trade-offs between wirelength and TS via number. Compared to the recently published transformation-based 3D placement method [1], we are able to achieve on average 12% shorter wirelength and 29% fewer TS via compared to their cases with best wirelength; we are also able to achieve on average 20% shorter wirelength and 50% fewer TS via number compared to their cases with best TS via numbers.
AbstractList In this paper we propose a multilevel non-linear programming based 3D placement approach that minimizes a weighted sum of total wirelength and TS via number subject to area density constraints. This approach relaxes the discrete layer assignments so that they are continuous in the z-direction and the problem can be solved by an analytical global placer. A key idea is to do the overlap removal and device layer assignment simultaneously by adding a density penalty function for both area & TS via density constraints. Experimental results show that this analytical placer in a multilevel framework is effective to achieve trade-offs between wirelength and TS via number. Compared to the recently published transformation-based 3D placement method [1], we are able to achieve on average 12% shorter wirelength and 29% fewer TS via compared to their cases with best wirelength; we are also able to achieve on average 20% shorter wirelength and 50% fewer TS via number compared to their cases with best TS via numbers.
Author Luo, Guojie
Cong, Jason
Author_xml – sequence: 1
  givenname: Jason
  surname: Cong
  fullname: Cong, Jason
  organization: University of California, Los Angeles and California NanoSystems Institute, Los Angeles, CA
– sequence: 2
  givenname: Guojie
  surname: Luo
  fullname: Luo, Guojie
  organization: California NanoSystems Institute, Los Angeles, CA
BookMark eNqNj0tLxDAURgMqqGPXbrt0YWuSe9M0y6G-Bgbc6DrkcQvVtJVpFfz3drA_wLM5m48PziU7HcaBGLsWvFQLd0JxUwGUR2upTlhmdC1QIkqNtTxn2TS98wVUoFBcsNtt3n-luUv0TSl3g0s_cxdcyj-TC9TTMOfteMjhPt810xU7a12aKFu9YW-PD6_Nc7F_edo1233hhNJzIQlN8KSEJuDcR85bFYlHFxGgrgKBC8ajjhorqIXwwA1K701Q0WHgsGE3f78u9NaP48dkBbfHQLsG2jVwmZb_nFp_6KiFX2OoUWE
ContentType Conference Proceeding
DOI 10.5555/1509633.1509725
DatabaseTitleList
DeliveryMethod fulltext_linktorsrc
EndPage 366
GroupedDBID 6IE
6IF
6IK
6IL
6IN
AAJGR
AAKMM
AARBI
ACM
ADPZR
ALMA_UNASSIGNED_HOLDINGS
BEFXN
BFFAM
BGNUA
BKEBE
BPEOZ
CBEJK
GUFHI
IERZE
OCL
RIE
RIL
ID FETCH-LOGICAL-a157t-2e49cbe517e300bd00f5de0dad43386ce3ac9b47d7463811b30942bb9c5da4c03
ISBN 9781424427482
1424427487
ISICitedReferencesCount 48
ISICitedReferencesURI http://www.webofscience.com/api/gateway?GWVersion=2&SrcApp=Summon&SrcAuth=ProQuest&DestLinkType=CitingArticles&DestApp=WOS_CPL&KeyUT=000265675400076&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D
IngestDate Mon Feb 05 09:26:46 EST 2024
Wed Jan 31 06:53:02 EST 2024
IsPeerReviewed false
IsScholarly false
Language English
LinkModel OpenURL
MeetingName ASPDAC '09: Asia and South Pacific Design Automation Conference
MergedId FETCHMERGED-LOGICAL-a157t-2e49cbe517e300bd00f5de0dad43386ce3ac9b47d7463811b30942bb9c5da4c03
PageCount 6
ParticipantIDs acm_books_10_5555_1509633_1509725
acm_books_10_5555_1509633_1509725_brief
PublicationCentury 2000
PublicationDate 20090119
PublicationDateYYYYMMDD 2009-01-19
PublicationDate_xml – month: 01
  year: 2009
  text: 20090119
  day: 19
PublicationDecade 2000
PublicationPlace Piscataway, NJ, USA
PublicationPlace_xml – name: Piscataway, NJ, USA
PublicationSeriesTitle ACM Conferences
PublicationTitle Proceedings of the 2009 Asia and South Pacific Design Automation Conference
PublicationYear 2009
Publisher IEEE Press
Publisher_xml – name: IEEE Press
SSID ssj0000453541
Score 1.5715033
Snippet In this paper we propose a multilevel non-linear programming based 3D placement approach that minimizes a weighted sum of total wirelength and TS via number...
SourceID acm
SourceType Publisher
StartPage 361
SubjectTerms Information systems
Information systems -- Data management systems
Information systems -- Data management systems -- Database administration
Information systems -- Data management systems -- Database administration -- Data dictionaries
Theory of computation
Theory of computation -- Design and analysis of algorithms
Theory of computation -- Design and analysis of algorithms -- Mathematical optimization
Title A multilevel analytical placement for 3D ICs
WOSCitedRecordID wos000265675400076&url=https%3A%2F%2Fcvtisr.summon.serialssolutions.com%2F%23%21%2Fsearch%3Fho%3Df%26include.ft.matches%3Dt%26l%3Dnull%26q%3D
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://cvtisr.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwtV3dT9wwDI8G2gNvTGPic-okpD3cCm2dkPTxdGxsEkM8AOKtStJUAkEP0bsJ_nvspl-cJgEP3EOviqpEtV3Hdn62GdtVvCgMik7IFbUwU1CEWgsItXK4_QgXpXU5hotjeXKiLi_T06YzXVW3E5BlqR4e0rt3ZTWOIbMpdfYN7O4mxQG8R6bjFdmO1wWL-L-bz2k3WLXn_3Q0gXzw6VejumneqAHjob4hBMdoPJ9NfRLjIAdwKE5jDz28IYwRTqNvHn0QvMZ01YACwivC4ejPpLPSJy3cV1f9Yf_xvA7OHs2n11d-BaKKq1Ao_g7Wfh6OILBVOFB65KI-Q494R7XOp0MH2DcaapQl-DLszb4LvvvKokoX-KPoApWpAdijf5mIJbYkZezT9bqQGlqnIHjcpu_RcrKt6tUu76s70aT7C1OSeWJvB8bF2Spb61876Nn3iX1w5Wf2Yxz0lA96ygcd5QOkfACHAVJ-jZ3_-nk2-R02LS5CHQs5CxPHU2uciKWDKDJ5FBUid1Gucw6gDqwDbVPDZS45Kso4NoDueGJMakWuuY3gC1sup6VbZ4E-SKwqOOSWfH4FpkDXN4ksgM4Nfqcb7Bu-X0aSWmXo-hENsoYGWUODDfb9xWcyg0JRbL5iti220kvINlue3c_dDvto_82uqvuvNe-eAKE8Pag
linkProvider IEEE
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Abook&rft.genre=proceeding&rft.title=Proceedings+of+the+2009+Asia+and+South+Pacific+Design+Automation+Conference&rft.atitle=A+multilevel+analytical+placement+for+3D+ICs&rft.au=Cong%2C+Jason&rft.au=Luo%2C+Guojie&rft.series=ACM+Conferences&rft.date=2009-01-19&rft.pub=IEEE+Press&rft.isbn=9781424427482&rft.spage=361&rft.epage=366&rft_id=info:doi/10.5555%2F1509633.1509725
thumbnail_l http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781424427482/lc.gif&client=summon&freeimage=true
thumbnail_m http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781424427482/mc.gif&client=summon&freeimage=true
thumbnail_s http://covers-cdn.summon.serialssolutions.com/index.aspx?isbn=9781424427482/sc.gif&client=summon&freeimage=true