APA (7th ed.) Citation

Cong, J., & Luo, G. (2009, January 19). A multilevel analytical placement for 3D ICs. Proceedings of the 2009 Asia and South Pacific Design Automation Conference, 361-366. https://doi.org/10.5555/1509633.1509725

Chicago Style (17th ed.) Citation

Cong, Jason, and Guojie Luo. "A Multilevel Analytical Placement for 3D ICs." Proceedings of the 2009 Asia and South Pacific Design Automation Conference 19 Jan. 2009: 361-366. https://doi.org/10.5555/1509633.1509725.

MLA (9th ed.) Citation

Cong, Jason, and Guojie Luo. "A Multilevel Analytical Placement for 3D ICs." Proceedings of the 2009 Asia and South Pacific Design Automation Conference, 19 Jan. 2009, pp. 361-366, https://doi.org/10.5555/1509633.1509725.