Výsledky vyhledávání - etching process control algorithm

Automatic speed control system for the chemical etching of thin films Autor Dalekorej, A.V., Ivanytsky, V.P., Kryuchyn, A.A., Legeta, Ya.P., Petrov, V.V., Rubish, V.M., Ryaboshchuk, M.M., Chychura, I.I.

“…The possibility of creating automatic control systems based on the interferometric optical method for chemical etching processes has been shown…”
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Improving Endpoint Detection Sensitivity in Plasma Etching With Small Openings Autor Qi, Lianhao, Mao, Jingyuan, Chang, Xiaoyang, Lin, Xiaoyang, Wang, Xinhe

“…We propose a method that enables real-time endpoint detection during plasma etching of small openings…”
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An Intelligent Optimization System Using Neural Networks and Soft Computing for the FMM Etching Process Autor Chen, Wen-Chin, Ngo, An-Xuan, Zhong, Jun-Fu

“…) etching process, a critical step in producing high-resolution AMOLED panels. The system integrates advanced optimization techniques, including the Taguchi method, analysis of variance (ANOVA…”
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Use of Plasma Information in Machine-Learning-Based Fault Detection and Classification for Advanced Equipment Control Autor Kim, Dong Hwan, Hong, Sang Jeen

“…For advanced equipment control, two schemata of real-time fault detection were performed using machine learning algorithms in silicon etching in SF 6 /O 2 /Ar plasma…”
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Generative Adversarial Network-Based Fault Detection in Semiconductor Equipment with Class-Imbalanced Data Autor Choi, Jeong Eun, Seol, Da Hoon, Kim, Chan Young, Hong, Sang Jeen

“…This research proposes an application of generative adversarial networks (GANs) to solve the class imbalance problem in the fault detection and classification study of a plasma etching process…”
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Controllable Fabrication of Gallium Ion Beam on Quartz Nanogrooves Autor Mo, Peizhen, Cheng, Jinyan, Xu, Qiuchen, Liu, Hongru, Wang, Chengyong, Li, Suyang, Yuan, Zhishan

“… This study proposes a method based on focused ion beam technology and a layer-by-layer etching process, successfully preparing V-shaped and rectangular nanogrooves on a silicon dioxide substrate…”
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Cause analysis of the faults in HARC etching processes by using the PI‐VM model for OLED display manufacturing Autor Park, Seolhye, Kyung, Yunyoung, Lee, Juyoung, Jang, Yongsuk, Cha, Taewon, Noh, Yeongil, Choi, Younghoon, Kim, Byungsoo, Cho, Taeyoung, Seo, Rabul, Yang, Jae‐Ho, Jang, Yunchang, Ryu, Sangwon, Kim, Gon‐Ho

“…High‐aspect ratio contact (HARC) etching is a bottleneck step of the high‐definition organic light emitting diode (OLED…”
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Noncyclic Scheduling of Cluster Tools With a Branch and Bound Algorithm Autor Kim, Hyun-Jung, Lee, Jun-Ho, Lee, Tae-Eog

“…Cluster tools, each of which consists of multiple processing modules, one material handling robot, and loadlocks, are widely used for wafer fabrication processes, such as lithography, etching, and deposition…”
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Similarity Ratio Analysis for Early Stage Fault Detection with Optical Emission Spectrometer in Plasma Etching Process Autor Yang, Jie, McArdle, Conor, Daniels, Stephen

“…) in plasma etching processes using real-time Optical Emission Spectrometer (OES) data as input. The SRA method can help to realise a highly precise control system by detecting abnormal etch-rate faults in real-time during an etching process…”
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Plasma information-based virtual metrology (PI-VM) and mass production process control Autor Park, Seolhye, Seong, Jaegu, Jang, Yunchang, Roh, Hyun-Joon, Kwon, Ji-Won, Lee, Jinyoung, Ryu, Sangwon, Song, Jaemin, Roh, Ki-Baek, Noh, Yeongil, Park, Yoona, Jang, Yongsuk, Cho, Taeyoung, Yang, Jae-Ho, Kim, Gon-Ho

“… Based on this, a plasma information-based virtual metrology (PI-VM) algorithm was developed drastically enhanced process prediction performance by parameterizing plasma information (PI…”
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Enhanced Temperature Control Method Using ANFIS with FPGA Autor Chang, Cheng-Yuan, Zhou, Jun-Tin, Pan, Shing-Tai, Huang, Chiung-Wei

“…Temperature control in etching process is important for semiconductor manufacturing technology…”
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Surface Coating of Hastelloy C 276 by WS2 Added Meso-electrical Discharge Alloying Process Autor Dutta, Souradeep, Sarma, Deba Kumar, Dutta, Hrishikesh

“… discharge alloying process. It investigates the impact of process characteristics i.e., gap voltage ( V a ), pulse on time ( t on ), and WS 2 powder concentration…”
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Adaptive weight tuning of EWMA controller via model-free deep reinforcement learning Autor Ma, Zhu, Pan, Tianhong

“…) control in semiconductor manufacturing processes. However, the EWMA controller with a fixed weight struggles to achieve excellent performance under unknown stochastic disturbances…”
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Dynamics and Control of Robot Manipulators

“… The effectiveness of these systems is challenged by new problems regarding their design, control, and planning, among others…”
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Modelling and parametric optimization of induction-aided hot embossing process to maximize the hydrophobicity of embossed PMMA polymer surface via metaheuristic techniques Autor Deshmukh, Swarup S.

“…Many researchers are interested in superhydrophobic surfaces because of their potential uses in science and industry. Superhydrophobic surfaces are often used…”
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Parameter optimization of etching process for a LGP stamper Autor Chen, Wen-Chin, Tai, Yi-Chia, Wang, Min-Wen, Tsai, Hsiang-Cheng

“… The control factors to conduct the process are etching temperature, specific gravity, spray pressure, transfer speed, and oscillating rate…”
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New Perspectives in Optical Design

“… Key areas covered in this reprint include advanced materials, coatings, and process technology for optical components…”
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Development of model predictive control of fluorine density in SF6/O2/Ar etch plasma by oxygen flow rate Autor Ryu, Sangwon, Kwon, Ji-Won, Park, Jihoon, Lee, Ingyu, Park, Seolhye, Kim, Gon-Ho

“…A model predictive controller (MPC) that controls the fluorine density to a constant level in the etching process plasma was developed…”
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Virtual Measurement Combine OCD and FDC Through Optimized Random Forest Machine Learning Algorithm Assists on Post Etching Monitor Autor Yang, Qingyun, Meng, Michael, Zheng, Alex, Lin, Paul, Gai, Kevin, Chen, Osim

“… To reduce rework and scraped, Etching is normally employed with process control systems like APC…”
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Failure Detection and Primary Cause Identification of Multivariate Time Series Data in Semiconductor Equipment Autor Baek, Minjae, Kim, Seoung Bum

“… Univariate control charts are commonly used to detect failures. However, because of the complexity of the process and the structural characteristics of the equipment, detection and identification of the causes of failures may be difficult…”
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