Výsledky vyhledávání - 3-D processor array
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Efficient 3-D Processor Array Reconfiguration Algorithms Based on Bucket Effect
ISSN: 0278-0070, 1937-4151Vydáno: New York IEEE 01.04.2024Vydáno v IEEE transactions on computer-aided design of integrated circuits and systems (01.04.2024)“…With the progressive augmentation of the density of 3-D processor arrays, some processor elements (PEs…”
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Efficient Reconfiguration Algorithm With Flexible Rerouting Schemes for Constructing 3-D VLSI Subarrays
ISSN: 0278-0070, 1937-4151Vydáno: New York IEEE 01.01.2020Vydáno v IEEE transactions on computer-aided design of integrated circuits and systems (01.01.2020)“…In this paper, we investigated the technique for improving the reliability of 3-D processor with faults by reconfiguring a 3-D fault-free subarray utilizing as many nonfaulty process elements (PEs) as possible…”
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An Alternative Mapping of 3-D Space onto Processor Arrays
ISSN: 0743-7315, 1096-0848Vydáno: San Diego, CA Elsevier Inc 01.12.1999Vydáno v Journal of parallel and distributed computing (01.12.1999)“… space onto low degree processor arrays. We show that the woven mesh can be embedded with dilation 2 and congestion 4 onto a 3-D mesh…”
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High resolution and frame rate image signal processor array design for 3-D imager
ISBN: 9781467350839, 1467350834Vydáno: IEEE 01.11.2012Vydáno v 2012 International Symposium on Intelligent Signal Processing and Communications Systems (01.11.2012)“…This paper presents a high resolution and frame rate image signal processor (ISP) array design for three-dimensional…”
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A Fast Fourier-Based Near-Field 3-D Imaging Algorithm for MIMO Array
ISSN: 0196-2892, 1558-0644Vydáno: New York IEEE 2024Vydáno v IEEE transactions on geoscience and remote sensing (2024)“… In this article, a fast Fourier-based near-field 3-D imaging algorithm for the MIMO array is proposed, and it requires less hardware processor memory capacity…”
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Mapping regular algorithms onto multilayered 3-D reconfigurable processor array
ISBN: 0769500013, 9780769500010Vydáno: IEEE 1999Vydáno v System Sciences, 1999: Annual Hawaii International Conference on System Sciences (32nd: 1999: Maui, Hawaii) (1999)“…Extends the systolic array approach and presents a 3D reconfigurable array processor with a method for mapping algorithms onto this processor…”
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IBM (IBM) issued patent titled "Interconnect circuits at three-dimensional (3-D) bonding interfaces of a processor array"
Vydáno: Melbourne News Bites Pty Ltd 13.08.2020Vydáno v News Bites - Computing & Information (13.08.2020)Získat plný text
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Fast Implementation of 3-D Digital Filters Via Systolic Array Processors
ISSN: 0923-6082, 1573-0824Vydáno: 01.07.1997Vydáno v Multidimensional systems and signal processing (01.07.1997)Získat plný text
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US Patent Issued to International Business Machines on Aug. 11 for "Interconnect circuits at three-dimensional (3-D) bonding interfaces of a processor array" (California, New York, Vermont, Texas Inventors)
Vydáno: Washington, D.C HT Digital Streams Limited 12.08.2020Vydáno v US Fed News Service, Including US State News (12.08.2020)Získat plný text
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High-Resolution Imager Based on Time-to-Space Conversion
ISSN: 0018-9456, 1557-9662Vydáno: New York IEEE 2022Vydáno v IEEE transactions on instrumentation and measurement (2022)“… The system uses cross delay line (CDL) detectors for particle identification and a fully configurable digital processor based on field programmable gate arrays (FPGAs…”
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US Patent Issued to International Business Machines on April 10 for "Interconnect circuits at three dimensional (3-D) bonding interfaces of a processor array" (New York Inventor)
Vydáno: Washington, D.C HT Digital Streams Limited 11.04.2018Vydáno v US Fed News Service, Including US State News (11.04.2018)Získat plný text
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US Patent Issued to International Business Machines on June 14 for "Interconnect circuits at three-dimensional (3-D) bonding interfaces of a processor array" (New York Inventor)
Vydáno: Washington, D.C HT Digital Streams Limited 28.06.2016Vydáno v US Fed News Service, Including US State News (28.06.2016)Získat plný text
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Design of Ternary Neural Network With 3-D Vertical RRAM Array
ISSN: 0018-9383, 1557-9646Vydáno: IEEE 01.06.2017Vydáno v IEEE transactions on electron devices (01.06.2017)“… This paper aims to extend such 2-D cross-point array to 3-D vertical array for storing and computing the large-scale weight matrices in the neural network…”
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3-D NAND Technology Achievements and Future Scaling Perspectives
ISSN: 0018-9383, 1557-9646Vydáno: New York IEEE 01.04.2020Vydáno v IEEE transactions on electron devices (01.04.2020)“… ) in the recent five years. The increase of word-line (WL) stacking from 24 to 128 layers, the scaling of bits per cell from 2 to 3 bits/cell and 4 bits/cell, and a CMOS under array technology enabled this successful 3-D NAND density scaling…”
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An Energy-Efficient Unstructured Sparsity-Aware Deep SNN Accelerator With 3-D Computation Array
ISSN: 0018-9200, 1558-173XVydáno: New York IEEE 01.03.2025Vydáno v IEEE journal of solid-state circuits (01.03.2025)“…: a 3-D computation array that allows parallel computation of multiple timesteps to maximize…”
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High-Density 3-D NAND Cell Array Design With Hybrid Bonding
ISSN: 0018-9383, 1557-9646Vydáno: New York IEEE 01.11.2023Vydáno v IEEE transactions on electron devices (01.11.2023)“…In this study, we propose a novel cell array structure suitable for hybrid bonding technology, which is considered one of the promising future technologies in 3-D NAND architecture…”
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Drain-Erase Scheme in Ferroelectric Field Effect Transistor-Part II: 3-D-NAND Architecture for In-Memory Computing
ISSN: 0018-9383, 1557-9646Vydáno: New York IEEE 01.03.2020Vydáno v IEEE transactions on electron devices (01.03.2020)“…) devices with the potential for in-memory computing. In this two-part article, we explore the feasibility of the FeFET-based 3-D NAND architecture for both in situ training and inference…”
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A 29-Gb/mm2 1-Tb 3-b/Cell 3-D Flash Memory With CMOS Direct Bonded Array (CBA) Technology
ISSN: 0018-9200Vydáno: IEEE 31.10.2025Vydáno v IEEE journal of solid-state circuits (31.10.2025)“…This article reports a 1-Tb 3-b/cell 3-D flash memory fabricated with CMOS direct bonded array (CBA) technology…”
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Computationally Efficient Surrogate-Assisted Design of Pyramidal-Shaped 3-D Reflectarray Antennas
ISSN: 0018-926X, 1558-2221Vydáno: New York IEEE 01.11.2022Vydáno v IEEE transactions on antennas and propagation (01.11.2022)“…Reflectarrays (RAs) have been attracting considerable interest in recent years due to their appealing features, in particular, the possibility of realizing pencil-beam radiation patterns, as in the phased arrays…”
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3-D AND-Type Flash Memory Architecture With High-κ Gate Dielectric for High-Density Synaptic Devices
ISSN: 0018-9383, 1557-9646Vydáno: New York IEEE 01.08.2021Vydáno v IEEE transactions on electron devices (01.08.2021)“…Advanced 3-D synaptic devices with a stackable AND-type rounded dual channel (RDC) flash memory structure are proposed for neuromorphic networks…”
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