Foundations of Heterogeneous Integration: An Industry-Based, 2.5D/3D Pathfinding and Co-Design Approach
This book provides a practical, hands-on approach to teach the foundation of 2.5D/3D heterogeneous design. Based on the author's extensive, industrial experience, this book enables integrated circuit design techniques that provide more memory to the logic chip, also allowing for mixing chips an...
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| Hlavní autor: | |
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| Médium: | Elektronický zdroj E-kniha |
| Jazyk: | angličtina |
| Vydáno: |
Cham :
Springer International Publishing,
2018.
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| Vydání: | 1st ed. 2018. |
| Témata: | |
| ISBN: | 9783319757698 |
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Obsah:
- Introduction
- Wirebond Physical Implementation
- Flip-Chip Physical Implementation
- Substrate Physical Implementation
- Conventional Design Flow
- Pathfinding and Co-Design.