Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding b...

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Hlavní autor: Seok, Seonho (Autor)
Médium: Elektronický zdroj E-kniha
Jazyk:angličtina
Vydáno: Cham : Springer International Publishing, 2018.
Vydání:1st ed. 2018.
Edice:Springer Series in Advanced Manufacturing,
Témata:
Manufactures.
Nanotechnology.
Materials science.
Tribology.
Corrosion and anti-corrosives.
Coatings.
ISBN:9783319778723
ISSN:1860-5168
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Obsah:
  • Overview of MEMS packaging technologies
  • Adhesion control techniques for debonding
  • FEM modeling of debonding
  • Polymer cap transfer packaging technologies
  • Thin film cap transfer packaging technology
  • Other related manufacturing technologies. .

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