Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method /

This book introduces microelectromechanical systems (MEMS) packaging utilizing polymers or thin films - a new and unique packaging technology. It first investigates the relationship between applied load and opening displacement as a function of benzocyclobutene (BCB) cap size to find the debonding b...

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Bibliographic Details

Main Author:	Seok, Seonho (Author)
Format:	Electronic eBook
Language:	English
Published:	Cham : Springer International Publishing, 2018.
Edition:	1st ed. 2018.
Series:	Springer Series in Advanced Manufacturing,
Subjects:	Manufactures. Nanotechnology. Materials science. Tribology. Corrosion and anti-corrosives. Coatings.
ISBN:	9783319778723
ISSN:	1860-5168
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