Seok, S. (2018). Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method (1st ed. 2018.). Springer International Publishing.
Chicago-Zitierstil (17. Ausg.)Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. 1st ed. 2018. Cham: Springer International Publishing, 2018.
MLA-Zitierstil (9. Ausg.)Seok, Seonho. Advanced Packaging and Manufacturing Technology Based on Adhesion Engineering: Wafer-Level Transfer Packaging and Fabrication Techniques Using Interface Energy Control Method. 1st ed. 2018. Springer International Publishing, 2018.