Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorro...

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Bibliographische Detailangaben

1. Verfasser:	Cheng, Jie (VerfasserIn)
Format:	Elektronisch E-Book
Sprache:	Englisch
Veröffentlicht:	Singapore : Springer Singapore , 2018.
Ausgabe:	1st ed. 2018.
Schriftenreihe:	Springer Theses, Recognizing Outstanding Ph.D. Research,
Schlagworte:	Manufactures. Tribology. Corrosion and anti-corrosives. Coatings. Electronics. Microelectronics.
ISBN:	9789811061653
ISSN:	2190-5053
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