Cheng, J. (2018). Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (1st ed. 2018.). Springer Singapore.
Citace podle Chicago (17th ed.)Cheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. 1st ed. 2018. Singapore: Springer Singapore, 2018.
Citace podle MLA (9th ed.)Cheng, Jie. Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect. 1st ed. 2018. Springer Singapore, 2018.
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