VAPOR CHAMBER WITH INTEGRATED BUBBLE PUMP
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| Název: | VAPOR CHAMBER WITH INTEGRATED BUBBLE PUMP |
|---|---|
| Document Number: | 20240334662 |
| Datum vydání: | October 3, 2024 |
| Appl. No: | 18/612272 |
| Application Filed: | March 21, 2024 |
| Abstrakt: | A vapor chamber for cooling a heat source is provided. The vapor chamber includes a cavity between a baseplate and a condenser wall, the cavity containing a cooling medium, wherein the baseplate has an evaporator side towards the cavity and an attachment side opposite to the evaporator side for attaching the heat source, wherein the baseplate is adapted for transferring heat from the attachment side to the cavity, such that cooling medium evaporates at the evaporator side and condenses at the condenser wall, and wherein the vapor chamber further includes a channel, which is at least partially connected to the baseplate, with an inlet below a liquid level of the cooling medium and an outlet above the liquid level and which provides a bubble pump for transporting the liquid medium from the inlet to the outlet. |
| Claim: | 1. A vapor chamber for cooling a heat source, wherein the vapor chamber comprises a cavity between a baseplate and a condenser wall, the cavity containing a cooling medium; wherein the baseplate has an evaporator side towards the cavity and an attachment side opposite to the evaporator side for attaching the heat source; wherein the baseplate is adapted for transferring heat from the attachment side to the cavity, such that cooling medium evaporates at the evaporator side and condenses at the condenser wall; wherein the vapor chamber further comprises a channel, the channel is at least partially connected to the baseplate, and with an inlet of the channel below a liquid level of the cooling medium and an outlet of the channel above the liquid level, the channel provides a bubble pump transporting configured to transport the cooling medium from the inlet to the outlet; and wherein the channel is at least partially embedded into the baseplate. |
| Claim: | 2. The vapor chamber of claim 1, wherein the channel has a diameter, such that vapor bubbles of the cooling medium forming in the channel transport liquid cooling medium along the channel. |
| Claim: | 3. (canceled) |
| Claim: | 4. The vapor chamber of claim 1, wherein a channel section having the inlet is embedded into the baseplate. |
| Claim: | 5. The vapor chamber of claim 1, wherein the channel is completely embedded into the baseplate. |
| Claim: | 6. The vapor chamber of claim 1, wherein a channel section having the outlet is distanced from the baseplate; or wherein the channel section having the outlet is pipe-shaped; or wherein a channel section having the outlet is distanced from the baseplate and is pipe-shaped. |
| Claim: | 7. The vapor chamber of claim 1, wherein the baseplate comprises pores sized to receive the cooling medium and adapted to transport the cooling medium by capillary forces. |
| Claim: | 8. The vapor chamber of claim 7, wherein a gradient of porosity increases from the attachment side to the evaporation side. |
| Claim: | 9. The vapor chamber of claim 1, wherein the baseplate and the condenser wall are aligned in a vertical direction, such that the liquid level in the cavity is transversal to the baseplate and the condenser wall; and wherein the channel runs at least partially along the vertical direction. |
| Claim: | 10. The vapor chamber of claim 1, wherein the vapor chamber and/or the baseplate with one or more channels formed as bubble pump is made by additive manufacturing. |
| Claim: | 11. A vapor chamber arrangement, comprising: the vapor chamber according to claim 1, wherein the baseplate is connected to the heat source; and wherein the heat source includes several hot spots and the outlet of the channel is situated at a hot spot. |
| Claim: | 12. The vapor chamber arrangement of claim 11, wherein the outlet is outside of the baseplate and is directed towards at least one of the hot spots. |
| Claim: | 13. The vapor chamber arrangement of claim 11, wherein a channel section of the channel providing the bubble pump is arranged besides the hot spots and/or runs outside of the hot spots. |
| Claim: | 14. The vapor chamber arrangement of claim 11, wherein the vapor chamber comprises at least two channels providing the bubble pump; and wherein outlets of the at least two channels are situated at different hot spots. |
| Claim: | 15. The vapor chamber arrangement of claim 11, being a power electronics arrangement, wherein the heat source is a power electronics module connected to the baseplate of the vapor chamber; and wherein the hot spots are generated by power semiconductor chips. |
| Current International Class: | 05 |
| Přístupové číslo: | edspap.20240334662 |
| Databáze: | USPTO Patent Applications |
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