Wang, J., Leng, T., Liu, C., Zhou, M. C., & Zhao, S. (2024). Scheduling of Single-Arm Cluster Tools Handling Multiple Wafer Types Based on Double-Layer Configuration of Processing Modules. Faculty Publications. https://doi.org/10.1109/TASE.2023.3332551
Chicago-Zitierstil (17. Ausg.)Wang, Jufeng, Tingting Leng, Chunfeng Liu, Meng Chu Zhou, und Side Zhao. "Scheduling of Single-Arm Cluster Tools Handling Multiple Wafer Types Based on Double-Layer Configuration of Processing Modules." Faculty Publications 2024. https://doi.org/10.1109/TASE.2023.3332551.
MLA-Zitierstil (9. Ausg.)Wang, Jufeng, et al. "Scheduling of Single-Arm Cluster Tools Handling Multiple Wafer Types Based on Double-Layer Configuration of Processing Modules." Faculty Publications, 2024, https://doi.org/10.1109/TASE.2023.3332551.