An Improved Thermal Coupling Network Model Considering Thermal Interface Material Aging of IGBT Modules - Qi Li; Feng Zhang; Li Guan; Xin Zhang; Xiaosong Hu; Yonghe Chen; Jianghui Zhai; Peng Zeng; Baozheng Yang; Shi Cheng; Xianwen Cui; Jian Ye (IEEE Transactions on Components, Packaging and Manufacturing Technology, 2025)