An Improved Thermal Coupling Network Model Considering Thermal Interface Material Aging of IGBT Modules
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| Titel: | An Improved Thermal Coupling Network Model Considering Thermal Interface Material Aging of IGBT Modules |
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| Autoren: | Qi Li, Feng Zhang, Li Guan, Xin Zhang, Xiaosong Hu, Yonghe Chen, Jianghui Zhai, Peng Zeng, Baozheng Yang, Shi Cheng, Xianwen Cui, Jian Ye |
| Quelle: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 15:1672-1681 |
| Verlagsinformationen: | Institute of Electrical and Electronics Engineers (IEEE), 2025. |
| Publikationsjahr: | 2025 |
| Publikationsart: | Article |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2025.3587813 |
| Rights: | IEEE Copyright |
| Dokumentencode: | edsair.doi...........c9ebcd756ce35ee6964db229cd0b33a8 |
| Datenbank: | OpenAIRE |
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Nájsť tento článok vo Web of Science | ISSN: | 21563985 21563950 |
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| DOI: | 10.1109/tcpmt.2025.3587813 |