Integrated Circuit Wafer Detection Based on Intelligent Information Processing

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Titel: Integrated Circuit Wafer Detection Based on Intelligent Information Processing
Autoren: Qing Liu, Limin Zhao, Zhe Hou, Jing Hao, Xiangbing Li, Yuxiang Zhao, Jinfang Yang, Jinbing Zhang
Quelle: 2023 IEEE 3rd International Conference on Computer Systems (ICCS). :183-187
Verlagsinformationen: IEEE, 2023.
Publikationsjahr: 2023
Publikationsart: Article
DOI: 10.1109/iccs59700.2023.10335523
Rights: STM Policy #29
Dokumentencode: edsair.doi...........4f5e6ea52b6b1fbdae6fdbf3cee1ada0
Datenbank: OpenAIRE
Beschreibung
DOI:10.1109/iccs59700.2023.10335523