Intelligent Optimization Design of GS-TSV With RDLs for Chiplet-Based Integrated System in IoT

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Titel: Intelligent Optimization Design of GS-TSV With RDLs for Chiplet-Based Integrated System in IoT
Autoren: Yawen Cui, Xianglong Wang, Dongdong Chen, Di Li, Yintang Yang
Quelle: IEEE Internet of Things Journal. 12:41061-41070
Verlagsinformationen: Institute of Electrical and Electronics Engineers (IEEE), 2025.
Publikationsjahr: 2025
Publikationsart: Article
ISSN: 2372-2541
DOI: 10.1109/jiot.2025.3591105
Rights: IEEE Copyright
Dokumentencode: edsair.doi...........3c6cf07ad0cbb29b6ed979e66c8cc6ea
Datenbank: OpenAIRE