Cui, Y., Wang, X., Chen, D., Li, D., & Yang, Y. (2025). Intelligent Optimization Design of GS-TSV With RDLs for Chiplet-Based Integrated System in IoT. IEEE Internet of Things Journal, 12, 41061-41070. https://doi.org/10.1109/jiot.2025.3591105
Citácia podle Chicago (17th ed.)Cui, Yawen, Xianglong Wang, Dongdong Chen, Di Li, a Yintang Yang. "Intelligent Optimization Design of GS-TSV With RDLs for Chiplet-Based Integrated System in IoT." IEEE Internet of Things Journal 12 (2025): 41061-41070. https://doi.org/10.1109/jiot.2025.3591105.
Citácia podľa MLA (8th ed.)Cui, Yawen, et al. "Intelligent Optimization Design of GS-TSV With RDLs for Chiplet-Based Integrated System in IoT." IEEE Internet of Things Journal, vol. 12, 2025, pp. 41061-41070, https://doi.org/10.1109/jiot.2025.3591105.