APA (7th ed.) Citation

Pan, Z., Bao, Y., & Wei, T. (2025). Twin-aware Monte Carlo simulation of microstructural evolution in copper through-silicon vias (TSVs) based on EBSD-initiated microstructures. Journal of Applied Physics, 138(23), 1-15. https://doi.org/10.1063/5.0302881

Chicago Style (17th ed.) Citation

Pan, Zhenliang, Yuchen Bao, and Tiwei Wei. "Twin-aware Monte Carlo Simulation of Microstructural Evolution in Copper Through-silicon Vias (TSVs) Based on EBSD-initiated Microstructures." Journal of Applied Physics 138, no. 23 (2025): 1-15. https://doi.org/10.1063/5.0302881.

MLA (9th ed.) Citation

Pan, Zhenliang, et al. "Twin-aware Monte Carlo Simulation of Microstructural Evolution in Copper Through-silicon Vias (TSVs) Based on EBSD-initiated Microstructures." Journal of Applied Physics, vol. 138, no. 23, 2025, pp. 1-15, https://doi.org/10.1063/5.0302881.