Optimization of microchannel heat sink based on multi-objective particle swarm optimization algorithm for integrated circuit chips cooling.
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| Název: | Optimization of microchannel heat sink based on multi-objective particle swarm optimization algorithm for integrated circuit chips cooling. |
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| Autoři: | Jiang, Meixia, Pan, Zhongliang |
| Zdroj: | Numerical Heat Transfer: Part B -- Fundamentals; 2025, Vol. 86 Issue 4, p840-858, 19p |
| Témata: | PARTICLE swarm optimization, INTEGRATED circuits, HEAT sinks, MULTI-objective optimization, TEMPERATURE distribution, THERMAL resistance |
| Abstrakt: | The microchannel heat sink is an effective way to solve the heat dissipation problem in integrated circuit chips. In order to obtain the high efficiency and low resistance microchannel heat sink, the three variables (△h, f, g) were selected as the design variables, and the thermal resistance and pumping power were selected as objective functions. Then, the RSM, multi-objective particle swarm optimization algorithm and K-means clustering method were comprehensively applied to the multi-objective optimization of the microchannel heat sink with turbulence to obtain the five representative solutions (Case A–Case E), and the results were verified by CFD. The research shows that the maximum relative errors between Pareto optimization values and numerical simulation values of thermal resistance and pumping power of the five groups representative solutions are 0.637% and 1.187%, respectively. The Pareto optimization values are in good agreement with the numerical simulation values, and there is an effective tradeoff point between the five representative solutions of the Pareto optimal solution to make both the pumping power and thermal resistance within the optimal range. Compared with before optimization and the research results of Han Wang et al. [Appl. Therm. Eng. 2022;215:118849], the comprehensive heat transfer performance of the optimized microchannel heat sink has been improved, where the comprehensive heat transfer performance of the Case B ( Δ h = 0.0400 mm, f = 0.0979 mm, g = 0.5000 mm) is the best. The maximum temperature and pressure drop of the optimized microchannel heat sink can be reduced by 3.045% and 7.659%, respectively. Compared with the research results of Han Wang et al. [Appl. Therm. Eng. 2022;215:118849], the temperature distribution more uniform and the pressure drop of the microchannel heat sink after optimization (Case B) decreased by 7.058%. This optimization method can provide a reference for the optimization design of the microchannel heat sink structure parameters for integrated circuit chips cooling. [ABSTRACT FROM AUTHOR] |
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| Databáze: | Complementary Index |
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