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Optimization of microchannel heat sink based on multi-objective particle swarm optimization algorithm for integrated circuit chips cooling.

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Název: Optimization of microchannel heat sink based on multi-objective particle swarm optimization algorithm for integrated circuit chips cooling.
Autoři: Jiang, Meixia, Pan, Zhongliang
Zdroj: Numerical Heat Transfer: Part B -- Fundamentals; 2025, Vol. 86 Issue 4, p840-858, 19p
Témata: PARTICLE swarm optimization, INTEGRATED circuits, HEAT sinks, MULTI-objective optimization, TEMPERATURE distribution, THERMAL resistance
Abstrakt: The microchannel heat sink is an effective way to solve the heat dissipation problem in integrated circuit chips. In order to obtain the high efficiency and low resistance microchannel heat sink, the three variables (△h, f, g) were selected as the design variables, and the thermal resistance and pumping power were selected as objective functions. Then, the RSM, multi-objective particle swarm optimization algorithm and K-means clustering method were comprehensively applied to the multi-objective optimization of the microchannel heat sink with turbulence to obtain the five representative solutions (Case A–Case E), and the results were verified by CFD. The research shows that the maximum relative errors between Pareto optimization values and numerical simulation values of thermal resistance and pumping power of the five groups representative solutions are 0.637% and 1.187%, respectively. The Pareto optimization values are in good agreement with the numerical simulation values, and there is an effective tradeoff point between the five representative solutions of the Pareto optimal solution to make both the pumping power and thermal resistance within the optimal range. Compared with before optimization and the research results of Han Wang et al. [Appl. Therm. Eng. 2022;215:118849], the comprehensive heat transfer performance of the optimized microchannel heat sink has been improved, where the comprehensive heat transfer performance of the Case B ( Δ h = 0.0400 mm, f = 0.0979 mm, g = 0.5000 mm) is the best. The maximum temperature and pressure drop of the optimized microchannel heat sink can be reduced by 3.045% and 7.659%, respectively. Compared with the research results of Han Wang et al. [Appl. Therm. Eng. 2022;215:118849], the temperature distribution more uniform and the pressure drop of the microchannel heat sink after optimization (Case B) decreased by 7.058%. This optimization method can provide a reference for the optimization design of the microchannel heat sink structure parameters for integrated circuit chips cooling. [ABSTRACT FROM AUTHOR]
Copyright of Numerical Heat Transfer: Part B -- Fundamentals is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract. (Copyright applies to all Abstracts.)
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Items – Name: Title
  Label: Title
  Group: Ti
  Data: Optimization of microchannel heat sink based on multi-objective particle swarm optimization algorithm for integrated circuit chips cooling.
– Name: Author
  Label: Authors
  Group: Au
  Data: <searchLink fieldCode="AR" term="%22Jiang%2C+Meixia%22">Jiang, Meixia</searchLink><br /><searchLink fieldCode="AR" term="%22Pan%2C+Zhongliang%22">Pan, Zhongliang</searchLink>
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  Group: Src
  Data: Numerical Heat Transfer: Part B -- Fundamentals; 2025, Vol. 86 Issue 4, p840-858, 19p
– Name: Subject
  Label: Subject Terms
  Group: Su
  Data: <searchLink fieldCode="DE" term="%22PARTICLE+swarm+optimization%22">PARTICLE swarm optimization</searchLink><br /><searchLink fieldCode="DE" term="%22INTEGRATED+circuits%22">INTEGRATED circuits</searchLink><br /><searchLink fieldCode="DE" term="%22HEAT+sinks%22">HEAT sinks</searchLink><br /><searchLink fieldCode="DE" term="%22MULTI-objective+optimization%22">MULTI-objective optimization</searchLink><br /><searchLink fieldCode="DE" term="%22TEMPERATURE+distribution%22">TEMPERATURE distribution</searchLink><br /><searchLink fieldCode="DE" term="%22THERMAL+resistance%22">THERMAL resistance</searchLink>
– Name: Abstract
  Label: Abstract
  Group: Ab
  Data: The microchannel heat sink is an effective way to solve the heat dissipation problem in integrated circuit chips. In order to obtain the high efficiency and low resistance microchannel heat sink, the three variables (△h, f, g) were selected as the design variables, and the thermal resistance and pumping power were selected as objective functions. Then, the RSM, multi-objective particle swarm optimization algorithm and K-means clustering method were comprehensively applied to the multi-objective optimization of the microchannel heat sink with turbulence to obtain the five representative solutions (Case A–Case E), and the results were verified by CFD. The research shows that the maximum relative errors between Pareto optimization values and numerical simulation values of thermal resistance and pumping power of the five groups representative solutions are 0.637% and 1.187%, respectively. The Pareto optimization values are in good agreement with the numerical simulation values, and there is an effective tradeoff point between the five representative solutions of the Pareto optimal solution to make both the pumping power and thermal resistance within the optimal range. Compared with before optimization and the research results of Han Wang et al. [Appl. Therm. Eng. 2022;215:118849], the comprehensive heat transfer performance of the optimized microchannel heat sink has been improved, where the comprehensive heat transfer performance of the Case B ( Δ h = 0.0400 mm, f = 0.0979 mm, g = 0.5000 mm) is the best. The maximum temperature and pressure drop of the optimized microchannel heat sink can be reduced by 3.045% and 7.659%, respectively. Compared with the research results of Han Wang et al. [Appl. Therm. Eng. 2022;215:118849], the temperature distribution more uniform and the pressure drop of the microchannel heat sink after optimization (Case B) decreased by 7.058%. This optimization method can provide a reference for the optimization design of the microchannel heat sink structure parameters for integrated circuit chips cooling. [ABSTRACT FROM AUTHOR]
– Name: Abstract
  Label:
  Group: Ab
  Data: <i>Copyright of Numerical Heat Transfer: Part B -- Fundamentals is the property of Taylor & Francis Ltd and its content may not be copied or emailed to multiple sites without the copyright holder's express written permission. Additionally, content may not be used with any artificial intelligence tools or machine learning technologies. However, users may print, download, or email articles for individual use. This abstract may be abridged. No warranty is given about the accuracy of the copy. Users should refer to the original published version of the material for the full abstract.</i> (Copyright applies to all Abstracts.)
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      – Type: doi
        Value: 10.1080/10407790.2023.2296620
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      – Code: eng
        Text: English
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      Pagination:
        PageCount: 19
        StartPage: 840
    Subjects:
      – SubjectFull: PARTICLE swarm optimization
        Type: general
      – SubjectFull: INTEGRATED circuits
        Type: general
      – SubjectFull: HEAT sinks
        Type: general
      – SubjectFull: MULTI-objective optimization
        Type: general
      – SubjectFull: TEMPERATURE distribution
        Type: general
      – SubjectFull: THERMAL resistance
        Type: general
    Titles:
      – TitleFull: Optimization of microchannel heat sink based on multi-objective particle swarm optimization algorithm for integrated circuit chips cooling.
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            NameFull: Jiang, Meixia
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            NameFull: Pan, Zhongliang
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              M: 04
              Text: 2025
              Type: published
              Y: 2025
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            – TitleFull: Numerical Heat Transfer: Part B -- Fundamentals
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