Ko, S., Yu, T., & Lee, T. (2021). Wafer Delay Analysis and Workload Balancing of Parallel Chambers for Dual-Armed Cluster Tools With Multiple Wafer Types. IEEE Transactions on Automation Science & Engineering, 18(3), 1516-1526. https://doi.org/10.1109/TASE.2021.3061140
Citace podle Chicago (17th ed.)Ko, Sung-Gil, Tae-Sun Yu, a Tae-Eog Lee. "Wafer Delay Analysis and Workload Balancing of Parallel Chambers for Dual-Armed Cluster Tools With Multiple Wafer Types." IEEE Transactions on Automation Science & Engineering 18, no. 3 (2021): 1516-1526. https://doi.org/10.1109/TASE.2021.3061140.
Citace podle MLA (9th ed.)Ko, Sung-Gil, et al. "Wafer Delay Analysis and Workload Balancing of Parallel Chambers for Dual-Armed Cluster Tools With Multiple Wafer Types." IEEE Transactions on Automation Science & Engineering, vol. 18, no. 3, 2021, pp. 1516-1526, https://doi.org/10.1109/TASE.2021.3061140.