Comparative Analysis of the Balance of Hardware and Software Academic Subjects: Two Study Programs in the Field of Computer Engineering.

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Bibliographic Details
Title: Comparative Analysis of the Balance of Hardware and Software Academic Subjects: Two Study Programs in the Field of Computer Engineering.
Authors: Aciu, Lia Elena1 lia.aciu@unitbv.ro, Motoașcă, Septimiu Daniel1, Ghiță-Pîrnuță, Oana Andreea1, Ogruțan, Petre Lucian1
Source: TEM Journal. Aug2025, Vol. 14 Issue 3, p2791-2798. 8p.
Subject Terms: *COMPUTER engineering, *CURRICULUM, *QUANTITATIVE research, *HIGHER education, *CURRICULUM change, *EDUCATIONAL evaluation
Abstract: New trends in society lead to the need for changes in the academic curricula. The increased demand for software skills for Computer Engineering graduates has led to curriculum adjustments. This paper analyzes the relationship between hardware and software academic subjects in two higher education programs with a similar profile. The paper presents the results of a quantitative descriptive statistical study involving 59 students. The results of the study were used to modify the weight of hardware and software subjects. A questionnaire completed by students shows their opinion on some aspects of the academic subjects taken during their undergraduate studies. [ABSTRACT FROM AUTHOR]
Database: Academic Search Index
Description
Abstract:New trends in society lead to the need for changes in the academic curricula. The increased demand for software skills for Computer Engineering graduates has led to curriculum adjustments. This paper analyzes the relationship between hardware and software academic subjects in two higher education programs with a similar profile. The paper presents the results of a quantitative descriptive statistical study involving 59 students. The results of the study were used to modify the weight of hardware and software subjects. A questionnaire completed by students shows their opinion on some aspects of the academic subjects taken during their undergraduate studies. [ABSTRACT FROM AUTHOR]
ISSN:22178309
DOI:10.18421/TEM143-79