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Characterization of Material Extrusion-Printed Amorphous Poly(Ether Ketone Ketone) (PEKK) Parts.

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Bibliographic Details
Title: Characterization of Material Extrusion-Printed Amorphous Poly(Ether Ketone Ketone) (PEKK) Parts.
Authors: Hanemann, Thomas1,2 (AUTHOR), Klein, Alexander1,2 (AUTHOR), Baumgärtner, Siegfried1 (AUTHOR), Jung, Judith1,2 (AUTHOR), Wilhelm, David1 (AUTHOR), Antusch, Steffen1 (AUTHOR)
Source: Polymers (20734360). Apr2025, Vol. 17 Issue 8, p1069. 13p.
Subject Terms: *MELT processing (Manufacturing process), *YOUNG'S modulus, *SURFACE roughness measurement, *THERMOMECHANICAL properties of metals, *PLASTICS engineering
Abstract: Poly(ether ketone ketone) (PEKK), as a representative of high-performance poly(aryl ether ketones), shows outstanding thermomechanical properties, opening up a huge range of different applications in various technical fields. Its appearance as a quasi-amorphous polymer with a certain suppression of the crystallization process facilitates melt processing via additive manufacturing processes like material extrusion (MEX), especially in fused filament fabrication (FFF). The quality of the printing process is proven in this work by tensile testing and surface roughness measurements of suitable specimens. The MEX printing of semicrystalline PEKK faces two major challenges: on the one hand, the very high printing temperature is in contrast to established engineering plastics, and on the other hand, it is difficult to avoid crystallization after printing. The first issue can be addressed by using suitably enhanced MEX printers and the second one by selecting adapted printing parameters. The measured Young's modulus (3.49 GPa) and tensile strength (104 MPa) values are higher than the related vendors' data given for filaments (3.0 GPa and 92 MPa, respectively). In addition, the temperature-dependent thermal conductivity is determined, and the values of well-established PEEK (poly(ether ether ketone)) in the temperature range from 20 to 180 °C are mostly slightly higher in comparison to the related PEKK data. Based on the results, PEKK can be a useful substitute for well-established PEEK because of their comparable properties. However, PEKK has a pronouncedly lower FFF printing temperature, combined with a reduced tendency of the device to warp after printing. A larger printed test part with some surface structures shows the improved printability of PEKK in comparison to PEEK. [ABSTRACT FROM AUTHOR]
Database: Academic Search Index
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