Výsledky vyhľadávania - etching process control algorithm

Automatic speed control system for the chemical etching of thin films

Autori: A.V. Dalekorej V.P. Ivanytsky A.A. Kryuchyn a ďalší

Zdroj: Фізика і хімія твердого тіла, Vol 26, Iss 1, Pp 91-99 (2025)

Predmety: automation of chemical etching processes, automatic control system, interference thickness control methods, etching process control algorithm, Physics, QC1-999

Popis súboru: electronic resource

Relation: https://journals.pnu.edu.ua/index.php/pcss/article/view/8778; https://doaj.org/toc/1729-4428; https://doaj.org/toc/2309-8589

Prístupová URL adresa: https://doaj.org/article/11ebda1d7b854bdaa3801d6349877357

An Intelligent Optimization System Using Neural Networks and Soft Computing for the FMM Etching Process.

Autori: Chen, Wen-Chin Ngo, An-Xuan Zhong, Jun-Fu

Zdroj: Mathematics (2227-7390). Jul2025, Vol. 13 Issue 13, p2050. 20p.

Predmety: *ARTIFICIAL neural networks, *SOFT computing, *MANUFACTURING processes, *PROCESS control systems, *ORGANIC light emitting diodes, *INDUSTRIAL costs, *AGILE manufacturing systems

A step towards accreditation: A robustness test of etching process.

Autori: Leonardi, F. Veschetti, M. Tonnarini, S. a ďalší

Zdroj: Applied Radiation & Isotopes. Aug2015, Vol. 102, p93-97. 5p.

Predmety: *ROBUST control, *ETCHING, *ALGORITHMS, *TEMPERATURE effect, *CHEMICAL processes

Deep reinforcement learning-assisted extended state observer for run-to-run control in the semiconductor manufacturing process.

Autori: Ma, Zhu Pan, Tianhong

Zdroj: Transactions of the Institute of Measurement & Control. Aug2024, Vol. 46 Issue 12, p2300-2312. 13p.

Predmety: *DEEP reinforcement learning, *SEMICONDUCTOR manufacturing, *MANUFACTURING processes, *ECOLOGICAL disturbances, *INTELLIGENT control systems

Process Control to Improve Yield in the Plasma Etching Process Using an Adaptively Trained Neural Network

Autori: Hun-Mo KIM Mun-Kyu CHOI

Zdroj: JSME International Journal Series C Mechanical Systems, Machine Elements and Manufacturing. 2000, 43(3):594

Improving Endpoint Detection Sensitivity in Plasma Etching With Small Openings.

Autori: Qi, Lianhao Mao, Jingyuan Chang, Xiaoyang a ďalší

Zdroj: IEEE Transactions on Semiconductor Manufacturing. Aug2025, Vol. 38 Issue 3, p717-727. 11p.

Predmety: *PLASMA etching, *INTEGRATED circuits manufacturing, *OPTICAL measurements, *SIGNAL detection, *SIGNAL processing, *REAL-time computing, *DIMENSIONAL reduction algorithms

Machine vision as input to a CMP process control algorithm

Use of Plasma Information in Machine-Learning-Based Fault Detection and Classification for Advanced Equipment Control.

Autori: Kim, Dong Hwan Hong, Sang Jeen

Zdroj: IEEE Transactions on Semiconductor Manufacturing. Aug2021, Vol. 34 Issue 3, p408-419. 12p.

Predmety: *INFORMATION technology, *ALGORITHMS, *GAS flow, *ELECTRON density, *EMISSION spectroscopy, *ELECTRON temperature

Modelling of plasma etching process using radial basis function network and genetic algorithm

Autori: Han, Dongil Moon, Seung Bin Park, Kyungyoung a ďalší

Zdroj: Vacuum. Aug2005, Vol. 79 Issue 3/4, p140-147. 8p.

Predmety: *SILICON compounds, *THIN films, *SOLID state electronics, *PLASMA confinement

Neural network based control strategies for improving plasma characteristics in reactive ion etching

Autori: Tudoroiu, N. Patel, R.V. Khorasani, K.

Zdroj: Neurocomputing. Mar2006, Vol. 69 Issue 7-9, p786-802. 17p.

Predmety: *IONS, *ETCHING, *PROCESS control systems, *ARTIFICIAL neural networks

Run-to-Run Process Adjustment Using Categorical Observations.

Autori: Wang, Kaibo Tsung, Fugee

Zdroj: Journal of Quality Technology. Oct2007, Vol. 39 Issue 4, p312-325. 14p. 4 Diagrams, 2 Charts, 3 Graphs.

Predmety: *PROCESS control systems, *ALGORITHMS, *QUALITATIVE research, *PARAMETER estimation, *QUANTITATIVE research, *ESTIMATION theory

Parameter optimization of etching process for a LGP stamper.

Autori: Chen, Wen-Chin Tai, Yi-Chia Wang, Min-Wen a ďalší

Zdroj: Neural Computing & Applications. Nov2013, Vol. 23 Issue 6, p1539-1550. 12p.

Predmety: *ETCHING, *PARAMETER estimation, *PLASTIC stamping, *MICROSTRUCTURE, *ORTHOGONAL arrays, *SIGNAL-to-noise ratio, *GENETIC algorithms, *PARTICLE swarm optimization

Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning.

Autori: Ma, Zhu Pan, Tianhong

Zdroj: IEEE Transactions on Semiconductor Manufacturing. Feb2023, Vol. 36 Issue 1, p91-99. 9p.

Predmety: *SEMICONDUCTOR manufacturing, *MANUFACTURING processes, *MARKOV processes, REINFORCEMENT learning, MOVING average process, FUNCTION spaces

Using neural networks for intelligent plasma etch process control. (cover story)

Autori: Card, Jill Laurin, Lise

Zdroj: Solid State Technology. Nov2002, Vol. 45 Issue 11, p33. 3p.

Predmety: *ARTIFICIAL neural networks, *PLASMA etching, *PROCESS control systems

MACHINE VISION AS INPUT TO A CMP PROCESS CONTROL ALGORITHM

Process Control and Management of Etching Process Using Data Mining with Quality Indexes.

Autori: Wang, Lipo Chen, Ke Ong, Yew a ďalší

Zdroj: Advances in Natural Computation (9783540283232). 2005, p1160-1169. 10p.

Machine vision as input to a CMP process control algorithm

Multimode Process Monitoring Based on Modified Density Peak Clustering and Parallel Variational Autoencoder.

Autori: Yu, Feng Liu, Jianchang Liu, Dongming

Zdroj: Mathematics (2227-7390). Jul2022, Vol. 10 Issue 14, pN.PAG-N.PAG. 19p.

Predmety: *PROBABILITY density function, *DEEP learning, *GAUSSIAN distribution, *FUZZY algorithms, *DENSITY, *MACHINE learning, *ELECTRONIC data processing

Industrial Data Reduction, Aggregation and Machine Learning-Based Soft Sensing for Etching and Slider Production Tools

Autori: Suherman, Julius Owen

Predmety: Chemical engineering, Industry 4.0, Machine Learning, Smart Manufacturing, Virtual Metrology

Popis súboru: application/pdf

Prístupová URL adresa: https://escholarship.org/uc/item/14x7r8r8
https://escholarship.org/content/qt14x7r8r8/qt14x7r8r8.pdf

Research on electrochemical discharge machining based on image features and SVM algorithm.

Autori: Bian, Jianxiao Ma, Baoji Paul, Anand a ďalší

Zdroj: Journal of Intelligent & Fuzzy Systems. 2021, Vol. 40 Issue 4, p7247-7258. 12p.

Predmety: *ALGORITHMS, *ELECTROCHEMICAL cutting, *BUBBLES, *LASER engraving, *IMAGE recognition (Computer vision), *MANAGEMENT controls