Suchergebnisse - Simulation Program with Integrated Circuit Emphasis (SPICE)-based multiphysics

SPICE-Based Multiphysics Model to Analyze the Dynamics of Ferroelectric Negative-Capacitance–Electrostatic MEMS Hybrid Actuators.

Autoren: Raman, Raghuram Tattamangalam Ajoy, Arvind

Quelle: IEEE Transactions on Electron Devices. Nov2020, Vol. 67 Issue 11, p5174-5181. 8p.

Schlagwörter: *SIMULATION Program with Integrated Circuit Emphasis, *MEMS resonators, *ACTUATORS, *FERROELECTRIC capacitors, *MICROELECTROMECHANICAL systems

NUMA-aware parallel sparse LU factorization for SPICE-based circuit simulators on ARM multi-core processors.

Autoren: Zhou, Junsheng Yang, Wangdong Dong, Fengkun et al.

Quelle: International Journal of High Performance Computing Applications; May2025, Vol. 39 Issue 3, p405-423, 19p

Schlagwörter: SIMULATION Program with Integrated Circuit Emphasis, TIME-domain analysis, MULTICORE processors, FREQUENCY-domain analysis, TIME-frequency analysis, PARALLEL computers

Research on Device Modeling Technique Based on MLP Neural Network for Model Parameter Extraction.

Autoren: Kang, Haixia Wu, Yuping Chen, Lan et al.

Quelle: Applied Sciences (2076-3417); Feb2022, Vol. 12 Issue 3, p1357, 16p

Schlagwörter: MULTILAYER perceptrons, ARTIFICIAL neural networks, SIMULATION Program with Integrated Circuit Emphasis, RUNNING speed

Equivalent Circuit Model for MEMS Vibrational Energy Harvester Compatible with Sinusoidal and Nonsinusoidal Vibrations.

Autoren: Hiroaki Honma Yukiya Tohyama Sho Ikeno et al.

Quelle: Sensors & Materials; 2020, Vol. 7 Issue 3, p2475-2492, 18p

Schlagwörter: SIMULATION Program with Integrated Circuit Emphasis, ELECTROSTATIC induction, ENERGY harvesting, KINETIC energy, ELECTRICAL energy

A Hybrid Electromagnetic-Circuit Method for Electromagnetic Interference Onto Mass Wires.

Autoren: Bayram, Yakup Volakis, John L.

Quelle: IEEE Transactions on Electromagnetic Compatibility; Nov2007, Vol. 49 Issue 4, p893-900, 8p

Schlagwörter: CABLE structures, ELECTROMAGNETIC interference, MULTICONDUCTOR transmission lines, ELECTRIC lines, ELECTRONIC circuits, INTEGRATED circuits

Towards Monolithic Indium Phosphide (InP)-Based Electronic Photonic Technologies for beyond 5G Communication Systems.

Autoren: Mukherjee, Chhandak Deng, Marina Nodjiadjim, Virginie et al.

Quelle: Applied Sciences (2076-3417); Mar2021, Vol. 11 Issue 5, p2393, 31p

Schlagwörter: MONTE Carlo method, SIMULATION Program with Integrated Circuit Emphasis, INTEGRATED circuit design, HETEROJUNCTION bipolar transistors, TELECOMMUNICATION systems, INDIUM phosphide, POWER electronics, TERAHERTZ technology

Towards Monolithic Indium Phosphide (InP)-Based Electronic Photonic Technologies for beyond 5G Communication Systems

Autoren: Chhandak, Mukherjee Deng, Marina Nodjiadjim, Virginie et al.

Weitere Verfasser: Chhandak, Mukherjee Deng, Marina Nodjiadjim, Virginie et al.

Quelle: ISSN: 2076-3417.

Schlagwörter: High frequency HF, Indium phosphide, Sub-millimeter wave, Terahertz communication, TCAD and Monte Carlo simulations, Electrical characterisation, Uni-traveling carrier photodiodes, Heterojunction bipolar transistors, Compact model, [SPI.TRON]Engineering Sciences [physics]/Electronics, [SPI.OPTI]Engineering Sciences [physics]/Optics / Photonic, [SPI.NANO]Engineering Sciences [physics]/Micro and nanotechnologies/Microelectronics, [INFO.INFO-MO]Computer Science [cs]/Modeling and Simulation

Verfügbarkeit: https://hal.science/hal-03163305
https://hal.science/hal-03163305v1/document
https://hal.science/hal-03163305v1/file/applsci-11-02393.pdf
https://doi.org/10.3390/app11052393

Modification of Cockcroft–Walton-Based High-Voltage Multipliers with 220 V and 50 Hz Input for Non-Thermal Food Processing Apparatus.

Autoren: Jaiwanglok, Anurak Eguchi, Kei Smerpitak, Krit et al.

Quelle: Sustainability (2071-1050); Aug2020, Vol. 12 Issue 16, p6330, 1p

Comparison of Radiation Modeling Techniques Up to 10 GHz--Application on a Microstrip PCB Trace.

Autoren: Rogard, Eric Azanowsky, Béatrice Ney, Michel M.

Quelle: IEEE Transactions on Electromagnetic Compatibility; May2010, Vol. 52 Issue 2, p479-486, 8p

Schlagwörter: INDUSTRIAL radiation applications, STRIP transmission lines, PRINTED circuits, ELECTROMAGNETIC compatibility, INTEGRATED circuits

An Ultra‐Flexible Solution‐Processed Metal‐Oxide/Carbon Nanotube Complementary Circuit Amplifier with Highly Reliable Electrical and Mechanical Stability.

Autoren: Kim, Kyung‐Tae Kang, Seung‐Han Kim, Jaeyoung et al.

Quelle: Advanced Electronic Materials; Jan2020, Vol. 6 Issue 1, pN.PAG-N.PAG, 1p

Schlagwörter: CMOS amplifiers, INTEGRATED circuits, BENDING stresses, FINITE element method, MULTIWALLED carbon nanotubes, NUMERICAL analysis, INTEGRATED circuit design, MODULATION-doped field-effect transistors

PreSCAN: A Comprehensive Review of Pre-Silicon Physical Side-Channel Vulnerability Assessment Methodologies.

Autoren: Bepary, Md Kawser Zhang, Tao Farahmandi, Farimah et al.

Quelle: Chips; Dec2024, Vol. 3 Issue 4, p311-333, 23p

Schlagwörter: ELECTRONIC design automation, LEAK detection, INTEGRATED circuit verification, COMPUTATIONAL electromagnetics, LEAKAGE

Static, Dynamic, and Signal-to-Noise Analysis of a Solid-State Magnetoelectric (Me) Sensor with a Spice-Based Circuit Simulator.

Autoren: Sindler, Yuri Lineykin, Simon

Quelle: Sensors (14248220); Aug2022, Vol. 22 Issue 15, p5514-N.PAG, 20p

Schlagwörter: DETECTOR circuits, ELECTRONIC equipment, FINITE element method, SIGNAL-to-noise ratio, GRAPH algorithms, COMPUTER software development, ELECTRIC circuits

A Hierarchical Simulation Flow for Return-Loss Optimization of Microprocessor Package Vertical Interconnects.

Autoren: Sathanur, Arun V. Jandhyala, Vikram Braunisch, Henning

Quelle: IEEE Transactions on Advanced Packaging; 11/01/2010, Vol. 33 Issue 4, p1021-1033, 13p

Schlagwörter: MICROPROCESSORS, ELECTRONIC packaging, INTEGRATED circuit interconnections, ELECTROMAGNETISM, MINIATURE electronic equipment, SURFACE analysis, PERFORMANCE evaluation

Full-Wave Real-Life 3-D Package Signal Integrity Analysis Using Nonconformal Domain Decomposition Method.

Autoren: Shao, Yang Peng, Zhen Lee, Jin-Fa

Quelle: IEEE Transactions on Microwave Theory & Techniques; 02/01/2011, Vol. 59 Issue 2, p230-241, 12p

Schlagwörter: INTEGRATED circuit interconnections, INTEGRATED circuits, SIGNAL integrity (Electronics), DECOMPOSITION method, MATHEMATICAL models, FINITE element method, NUMERICAL analysis

Perspectives on Technology and Technology-Driven CAD.

Autoren: Dutton, Robert W. Strojwas, Andrzej J.

Quelle: IEEE Transactions on Computer-Aided Design of Integrated Circuits & Systems; Dec2000, Vol. 19 Issue 12, p1544, 17p, 1 Black and White Photograph, 14 Diagrams, 2 Graphs

Schlagwörter: COMPUTER-aided design, TECHNOLOGY, TECHNOLOGICAL innovations, INTEGRATED circuits

Experimentally Validated Modelling of a Base-Excited Piezoelectric Vibration Energy Harvester Connected to a Full Wave Rectified Load.

Autoren: Bonello, Philip Alalwan, Maher

Quelle: Sensors (14248220); Oct2025, Vol. 25 Issue 20, p6305, 28p

Schlagwörter: ENERGY harvesting, CURRENT-voltage characteristics, PIEZOELECTRICITY, EULER-Bernoulli beam theory, DYNAMICAL systems, DC-AC converters, VOLTAGE

Temperature-Dependent Characterization of Power Amplifiers Using an Efficient Electrothermal Analysis Technique.

Autoren: Taghikhani, Parastoo Buisman, Koen Versleijen, Martin et al.

Quelle: IEEE Transactions on Microwave Theory & Techniques; Feb2022, Vol. 70 Issue 2, p1349-1360, 12p

Schlagwörter: CURVE fitting, INTEGRATED circuits, FINITE element method, COMPUTER-aided design, TEMPERATURE effect

Sensor Arrays: A Comprehensive Systematic Review.

Autoren: Domínguez-Gimeno, Sergio Igual-Catalán, Raúl Plaza-García, Inmaculada

Quelle: Sensors (14248220); Aug2025, Vol. 25 Issue 16, p5089, 176p

Schlagwörter: SENSOR arrays, DIGITAL technology, DATA acquisition systems, TECHNOLOGICAL innovations, TECHNICAL specifications

Enhancing the student experience in pre‐ and mid‐COVID‐19 pandemic period by upgrading the power electronics laboratory practice curriculum.

Autoren: Rihar, Andraž Vončina, Danjel Zajec, Peter

Quelle: Computer Applications in Engineering Education; May2023, Vol. 31 Issue 3, p480-500, 21p

Schlagwörter: ELECTRICAL engineering education, INSTRUCTIONAL materials centers, STAY-at-home orders, POWER electronics, CURRICULUM change, COVID-19 pandemic

Nonlinear compact thermal modeling of self-adaptability for GaN high-electron-mobility-transistors using Gaussian process predictor and ensemble Kalman filter.

Autoren: Hua, Yuchao Luo, Lingai Le Corre, Steven et al.

Quelle: Journal of Applied Physics; 1/7/2024, Vol. 135 Issue 1, p1-12, 12p

Schlagwörter: KALMAN filtering, GAUSSIAN processes, GALLIUM nitride, MODULATION-doped field-effect transistors, FINITE element method