Search Results - "finite element simulation"

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    Authors: Yuan Gao Kai Yin Claus Leth Bak et al.

    Source: Gao, Y, Yin, K, Bak, C L, Jørgensen, A B, Zhang, Z, Zhao, H, Munk-Nielsen, S, Uhrenfeldt, C & Aunsborg, T S 2025, 'Impacts of the Bottom Copper Layer of Direct-Bond Copper Substrates on the Partial Discharge Performance in Power Modules', I E E E Transactions on Power Electronics, vol. 40, no. 4, pp. 5999-6009. https://doi.org/10.1109/TPEL.2024.3516534

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    Source: Healthc Technol Lett
    Healthcare Technology Letters, Vol 11, Iss 6, Pp 392-401 (2024)

    File Description: application/pdf

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