Suchergebnisse - "Wang, Xinyue"
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Autoren: et al.
Quelle: Scientific Reports ; volume 15, issue 1 ; ISSN 2045-2322
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Autoren: et al.
Quelle: 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC). :1982-1988
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Autoren: et al.
Weitere Verfasser: et al.
Quelle: 2022 IEEE 72nd Electronic Components and Technology Conference (ECTC). :507-512
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Autoren: et al.
Quelle: Engineering, Vol 17, Iss, Pp 99-109 (2022)
Schlagwörter: Micromechanical modeling, Interfacial transition zone, 0211 other engineering and technologies, Nanofiller, Nano-core effect, 02 engineering and technology, TA1-2040, Engineering (General). Civil engineering (General), 0210 nano-technology, Nanoindentation, Concrete
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Autoren: et al.
Quelle: Nature Communications ; volume 13, issue 1 ; ISSN 2041-1723
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Autoren: et al.
Quelle: APL Materials; Nov2025, Vol. 13 Issue 11, p1-8, 8p
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Autoren: et al.
Quelle: Veterinary Sciences. Jun2025, Vol. 12 Issue 6, p598. 18p.
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Autoren: et al.
Quelle: Nature Communications; 7/24/2025, Vol. 16 Issue 1, p1-13, 13p
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Ligand-controlled regiodivergent and enantioselective hydrophosphorylation of styrenes by palladium.
Autoren: et al.
Quelle: Nature Communications; 7/1/2025, Vol. 16 Issue 1, p1-10, 10p
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Autoren: et al.
Quelle: Atmospheric Chemistry & Physics; 2025, Vol. 25 Issue 20, p13161-13176, 16p
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Autoren: et al.
Quelle: Journal of Electronic Packaging. 144
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Index Begriffe: journal article
URL:
http://resolver.tudelft.nl/uuid:046880f9-39e1-44e3-8138-ffe45babfb8c http://www.scopus.com/inward/record.url?scp=85168427130&partnerID=8YFLogxK http://www.scopus.com/inward/record.url?scp=85168427130&partnerID=8YFLogxK
Journal of Materials Science: Materials in Electronics--0957-4522--4e2ef285-53a7-4e7e-8df2-7776cfc76a4e -
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Autoren: et al.
Quelle: Journal of Translational Medicine; 10/27/2025, Vol. 23 Issue 1, p1-14, 14p
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Autoren: et al.
Quelle: Orphanet Journal of Rare Diseases; 10/22/2025, Vol. 20 Issue 1, p1-9, 9p
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Autoren: et al.
Quelle: Nature Communications; 1/4/2025, Vol. 16, p1-10, 10p
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Autoren: et al.
Quelle: Frontiers in Artificial Intelligence; 2025, p1-8, 8p
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Autoren: et al.
Quelle: Advanced Science; 8/28/2025, Vol. 12 Issue 32, p1-20, 20p
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