Suchergebnisse - "THERMAL interface materials"

Diffusion behavior and microstructural evolution of bonding interface between AuSn20 and tungsten-copper alloy.

Autoren: Ding, Fei Wang, Qidong Liang, Chaoping et al.

Quelle: Soldering & Surface Mount Technology. 2025, Vol. 37 Issue 5, p333-341. 9p.

Schlagwörter: INTERFACIAL bonding, THERMAL interface materials, MATERIALS science, INTERFACE structures, KIRKENDALL effect, TUNGSTEN alloys, AB-initio calculations

Ag Microparticle/Au Nanoparticle Thermal Interface Materials Sintered at Low Temperature and Pressure.

Autoren: Stojek, Krzysztof Nowak, Adam Krzysztof Rac-Rumijowska, Olga et al.

Quelle: Materials (1996-1944). Nov2025, Vol. 18 Issue 21, p4981. 17p.

Schlagwörter: *THERMAL interface materials, *THERMAL resistance, *TENSILE strength, *GOLD nanoparticles, *SILVER nanoparticles, *MECHANICAL behavior of materials, *SINTERING

Fluorine-modified double-nanostructured GO coatings to perpetuate high thermal conduction.

Autoren: Zhou, Wenjun Mu, Yuxin Yu, Qiang et al.

Quelle: Journal of Materials Science. Oct2025, Vol. 60 Issue 40, p18984-18998. 15p.

Schlagwörter: *THERMAL conductivity, *THERMAL interface materials, *INSULATING materials, *FLUORINE, *SURFACE coatings, *NANOSTRUCTURED materials

Dandelion‐Inspired Radial Oriented Microspheres for Dynamic Interface Thermal Management.

Autoren: He, Qingxia Zhang, Heng Zhang, Zhixing et al.

Quelle: Advanced Functional Materials. Oct2025, p1. 13p. 7 Illustrations.

Schlagwörter: *THERMAL interface materials, *GRAPHENE, *DYNAMIC stability, *FLEXIBLE electronics, *BIOMIMETICS, *METAL nanoparticles, *MICROSPHERES, *TEMPERATURE control equipment

Synergistic enhancement in thermal conductivity of RTV silicone rubber via non-covalently surface-modified graphene and MWCNT hybrid fillers.

Autoren: Chandrashekar, Akshatha Hegde, Madhushree Siya Shetty et al.

Quelle: Journal of Materials Science. Oct2025, Vol. 60 Issue 37, p16899-16920. 22p.

Schlagwörter: *THERMAL conductivity, *THERMAL interface materials, *GRAPHENE, *INSULATING materials, *COMPOSITE materials, *MULTIWALLED carbon nanotubes, *FILLER materials

Analytical study of the thermal inclusion problem in a half-plane.

Autoren: Ding, Xinyi Zou, Wennan

Quelle: Journal of Thermal Stresses. 2025, Vol. 48 Issue 10, p1300-1313. 14p.

Schlagwörter: *BOUNDARY value problems, *THERMAL interface materials, *STRESS concentration, *COMPLEX variables, *BOUNDARY element methods

Predicting bond line thickness of polymeric thermal interface materials based on the rheological properties.

Autoren: Fan, Jianfeng Ye, Zhenqiang Zeng, Xiaoliang et al.

Quelle: Journal of Applied Physics. 7/14/2024, Vol. 136 Issue 2, p1-11. 11p.

Schlagwörter: *THERMAL interface materials, *RHEOLOGY, *THERMAL properties, *EXPONENTIAL functions, *THERMAL conductivity, *FORECASTING

Bi‐Directional Assembly of Boron Nitride µ‐Platelets by Micro‐Molding for Advanced Thermal Interface Materials.

Autoren: Kim, Young Gil Jung, In‐Young Mun, Yujin et al.

Quelle: Advanced Functional Materials. 9/18/2025, Vol. 35 Issue 38, p1-13. 13p.

Schlagwörter: *BORON nitride, *THERMAL interface materials, *HEATING control, *MOLDING materials, *FLEXIBILITY (Mechanics), *THREE-dimensional integrated circuits, *POLYMERIC composites, *THERMAL conductivity

Electrically insulative and thermally conductive hydrophobic composite sheets based on cellulose nanofibers for thermal interface applications.

Autoren: Sathwane, Manoj Nandi, Upendranath Banerjee, Arnab et al.

Quelle: Polymer Composites. 9/10/2025, Vol. 46 Issue 13, p12025-12046. 22p.

Schlagwörter: *THERMAL interface materials, *THERMAL conductivity, *BIODEGRADABLE materials, *CELLULOSE nanocrystals, *NANOSTRUCTURED materials, *DIELECTRICS, *COMPOSITE materials, *THERMAL stability

Highly viable nanoparticle based Thermal Interface Materials (TIM) for electronics device cooling applications.

Autoren: MAHESHWARI, S. Uma SOLOMON, A. Brusly THILAGAVATHI, G. et al.

Quelle: Journal of Thermal Engineering. Sep2025, Vol. 11 Issue 5, p1312-1326. 15p.

Schlagwörter: *THERMAL interface materials, *THERMAL resistance, *PARAFFIN wax, *HEAT conduction, *COOLING systems, *NANOPARTICLES

Comparative analysis of thermal interface materials for effective thermal management of electronic devices.

Autoren: Husain, Saddam Asif, Mohammad Khan, Khursheed Anwar

Quelle: Experimental Heat Transfer. 2025, Vol. 38 Issue 5, p405-424. 20p.

Schlagwörter: *THERMAL interface materials, *ALUMINUM powder, *HEAT storage, *HEAT capacity, *ELECTRONIC equipment

Helical Carbon Fiber‐Based Phase Change Thermal Interface Materials: Unlocking Superior Thermal Conductivity through Novel Structural Engineering.

Autoren: Tang, Yanpei Zhang, Yafang Liu, Junhao et al.

Quelle: Small Structures. Sep2025, Vol. 6 Issue 9, p1-12. 12p.

Schlagwörter: *THERMAL conductivity, *THERMAL interface materials, *HEAT transfer, *PHASE change materials, *CARBON fibers, *STRUCTURAL engineering, *FLEXIBILITY (Mechanics)

Interfacial Networks Engineering Towards Recyclable, Highly Thermally Conductive and Mechanically Robust Natural Rubber Composites.

Autoren: Han, Xu Gong, Chang Hou, Dewang et al.

Quelle: Polymer Composites. Aug2025, p1. 13p. 11 Illustrations.

Schlagwörter: *THERMAL interface materials, *THERMAL conductivity, *WASTE recycling, *SUSTAINABILITY, *RUBBER, *DUCTILITY, *INTERFACE structures, *NANOCOMPOSITE materials

Scalable thermal interface materials with close‐packed structure and high through‐plane thermal conductivity.

Autoren: Feng, Chang‐Ping Ji, Jin‐Chao Xu, Shao‐Cun et al.

Quelle: Polymer Composites. 8/10/2025, Vol. 46 Issue 11, p10187-10196. 10p.

Schlagwörter: *THERMAL interface materials, *THERMAL conductivity, *CONDENSED matter, *GRAPHENE, *COMPOSITE materials, *ELECTRONIC packaging, *HEAT transfer

Conversion of alumina felt to aluminum nitride felt via carbothermal reduction and nitridation using different carbon sources.

Autoren: Makrifatullah, Lazuardi Ihsan Lee, Sang-Min Yoon, Dang-Hyok et al.

Quelle: Ceramics International. Aug2025:Part A, Vol. 51 Issue 20, p30832-30842. 11p.

Schlagwörter: *THERMAL interface materials, *ALUMINUM nitride, *ALUMINUM oxide, *PHENOLIC resins, *NITRIDATION

Thermal Conducting Channel Based on the Concept of Biological Buffer Compensation System: High Speed and Stable Phonon Transport.

Autoren: Wu, Xinheng Zhang, Hao Chen, Defeng et al.

Quelle: Polymer Composites. Aug2025, p1. 13p. 8 Illustrations.

Schlagwörter: *THERMAL conductivity, *THERMAL interface materials, *COVALENT bonds, *HEAT conduction, *CARBON nanotubes, *POLYURETHANES, *THERMAL stability, *BORON nitride

Highly thermal conductivity flexible composite films based on alumina-boron nitride binary fillers.

Autoren: Hu, Xin Sha, Xiaolu Zhao, Xinyu et al.

Quelle: Ceramics International. Aug2025:Part A, Vol. 51 Issue 19, p28132-28141. 10p.

Schlagwörter: *THERMAL interface materials, *ALUMINUM oxide, *THERMAL conductivity, *ELECTRIC conductivity, *ELECTRIC insulators & insulation

A Flexible Thermal Interface Material as the Heat Switch for Solid‐State Cooling.

Autoren: Luo, Wenmei Zhang, Xingwei Luo, Tianlin et al.

Quelle: Advanced Functional Materials. Jul2025, p1. 9p. 4 Illustrations.

Schlagwörter: *THERMAL interface materials, *MAGNETIC fields, *THERMAL conductivity, *COMPOSITE materials, *HEATING control, *TEMPERATURE control, *THERMOELECTRIC cooling

Effect of oxide additives for spherical hexagonal boron nitride fillers on the thermal conductivity of the epoxy composites.

Autoren: Zhou, Huayuan Sekino, Tohru Feng, Qi et al.

Quelle: Ceramics International. Jul2025:Part A, Vol. 51 Issue 18, p25299-25309. 11p.

Schlagwörter: *THERMAL interface materials, *THERMAL conductivity, *CERIUM oxides, *CONDUCTING polymers, *HEAT treatment

Preparation and molecular dynamics simulation of natural rubber thermal conductive composites reinforced with boron nitride modified by a hyperbranched coupling agent.

Autoren: Qin, Zhengying Wang, Linquan Lin, Xinfeng et al.

Quelle: Polymer Composites. 7/10/2025, Vol. 46 Issue 10, p9115-9133. 19p.

Schlagwörter: *THERMAL interface materials, *COUPLING agents (Chemistry), *BORON nitride, *MOLECULAR dynamics, *THERMAL conductivity, *REINFORCEMENT of rubber