Search Results - "Intermetallic"

Sub-Kelvin magnetocaloric effect in frustrated intermetallic NdNi4Mg.

Authors: Zhang, Xiaoci Zhang, Te Liu, Xinyang et al.

Source: Journal of Applied Physics. 8/14/2025, Vol. 138 Issue 6, p1-7. 7p.

Subject Terms: *MAGNETOCALORIC effects, *INTERMETALLIC compounds, *MAGNETIC cooling, *SINGLE crystals, *NEODYMIUM compounds, *DEMAGNETIZATION

Enhanced iron impurity removal in low iron Al-Si alloys by Mn addition

Authors: Harazeen, Abdullah Lattanzi, Lucia Matsushita, Taishi et al.

Source: Kliral – Climate-adapted purified aluminium High Temperatures-High Pressures. 54(2):187-201

Subject Terms: Al-Si alloy, Purification, Sludge, Fe-bearing intermetallic particles, Manganese, Scanning electron microscopy, Fe removal, Refining, Cleaning, Microstructure

File Description: print

Access URL: https://urn.kb.se/resolve?urn=urn:nbn:se:hj:diva-67862
https://doi.org/10.32908/hthp.v54.1905

Enhancing duplex stainless steel additive manufacturing with DED-LB/w: microstructural analysis and process optimization

Authors: Westin, Elin Marianne Valiente Bermejo, María Asunción Axelsson, Björn et al.

Source: Welding in the World. :1-18

Subject Terms: Duplex stainless steel, Additive manufacturing, Directed energy deposition, MicroscopyMi, crostructureSolidification behavior, Phase transformations, Imperfections, Solidification cracking, Intermetallic phases, Production Technology, Produktionsteknik

File Description: electronic

Access URL: https://urn.kb.se/resolve?urn=urn:nbn:se:hv:diva-23410
https://doi.org/10.1007/s40194-025-02053-y

Formation of coherent nanocomposite structure in nickel-aluminum alloys synthesized far from equilibrium

Authors: Chen, Zhehao Fellman, Aslak J.J. Mulewska, Katarzyna et al.

Source: Acta Materialia. 302

Subject Terms: High-resolution tem, Intermetallic, Magnetron sputtering, Metastable alloys, Ni-based alloys, Numerical calculations, Self-organized nanostructures, Thin films

File Description: print

Access URL: https://urn.kb.se/resolve?urn=urn:nbn:se:kth:diva-373156
https://doi.org/10.1016/j.actamat.2025.121674

First-principles assisted design of high-entropy thermoelectric materials based on half-Heusler alloys.

Authors: Zhang, Chi Yan, Na Zhao, Changxin et al.

Source: Journal of Applied Physics. 1/7/2025, Vol. 137 Issue 1, p1-18. 18p.

Subject Terms: *INTERMETALLIC compounds, *CARRIER density, *DEFORMATION potential, *MOLECULAR dynamics, *THERMAL conductivity, *THERMOELECTRIC materials

Electromigration-induced diffusion behavior of Zn and abnormal intermetallic growth in Cu/Sn-9Zn/Cu(Ni) interconnects.

Authors: Zhou, Qiang Niu, Zuocheng Hong, Yuan et al.

Source: Soldering & Surface Mount Technology. 2025, Vol. 37 Issue 5, p342-352. 11p.

Subject Terms: *RELIABILITY in engineering, INTERMETALLIC compounds, CURRENT density (Electromagnetism), ZINC transporters, SOLDER joints, INTEGRATED circuit interconnections, ELECTRODIFFUSION, CONCENTRATION gradient

Comparative evaluation of Nb, Nb-Cu, and Ta-Cu interlayers on microstructural and mechanical behavior of dissimilar welds of grade 6 Ti and stainless steel.

Authors: Jawad, Muhammad Hanif, Muhammad Waqas Ali, Muhammad Asad et al.

Source: Scientific Reports. 11/25/2025, Vol. 15 Issue 1, p1-19. 19p.

Subject Terms: *DISSIMILAR welding, *INTERMETALLIC compounds, *MATERIALS science, *STRAINS & stresses (Mechanics), *TITANIUM alloys, *STAINLESS steel, *GAS tungsten arc welding, *INTERFACES (Physical sciences)

Intermetallic Co3Sn2 catalyst with isolated and electron-rich Co active sites for efficient acetylene semihydrogenation.

Authors: Fei, Nina Ge, Xiaohu Jiang, Hao et al.

Source: Chemical Communications. 11/25/2025, Vol. 61 Issue 91, p17866-17869. 4p.

Subject Terms: *HYDROGENATION, *INTERMETALLIC compounds, *CATALYSTS, *CATALYTIC activity, *ETHYLENE, *BIMETALLIC catalysts

Advancements in TLP Bonding for Power Electronics Die‐Attach Applications.

Authors: Battal, Fatin Boss, Davey Poelma, René H. et al.

Source: Advanced Materials Technologies. Nov2025, p1. 21p. 16 Illustrations.

Subject Terms: *POWER electronics, *INTERMETALLIC compounds, *INTERFACIAL bonding, *MATERIALS science, *TENSILE strength, *THERMAL stability

Descriptor‐Driven Design of Dual‐Active‐Site Electrocatalysts for Ammonia Synthesis.

Authors: Ma, Chaoqun Feng, Fukai Zhang, Huaifang et al.

Source: Advanced Energy Materials. Nov2025, p1. 12p. 8 Illustrations.

Subject Terms: *ELECTROCATALYSTS, *INTERMETALLIC compounds, *DENSITY functional theory, *CATALYTIC activity, *DENITRIFICATION, *HYDROGEN production

Atomically Ordered RuGa Intermetallic Electrocatalyst Enables High‐Efficiency Nitrate‐to‐Ammonia Conversion.

Authors: Yu, Yong‐Zhi Jiang, Qiu‐Ling Cheng, Yu et al.

Source: Advanced Functional Materials. Nov2025, p1. 12p. 7 Illustrations.

Subject Terms: *ELECTROCATALYSIS, *INTERMETALLIC compounds, *ENERGY consumption, *DENITRIFICATION, *STORAGE batteries, *NITROGEN fixation

Electrochemical co-deposition of Lu(III) with Bi(III) and extraction of Lu on Bi electrode.

Authors: Zhang, Xin Xiao, Yuying Li, Wenlong et al.

Source: Journal of Solid State Electrochemistry. Nov2025, Vol. 29 Issue 11, p4917-4925. 9p.

Subject Terms: *CYCLIC voltammetry, *INTERMETALLIC compounds, *ELECTROLYSIS, *FUSED salts, *ELECTRODES, *THERMODYNAMICS

Aluminum-rich cage compounds AT2Al20 (A = Sr, Eu; T = Ti, V)

Authors: Schumacher, Lars Pöttgen, Rainer

Source: Zeitschrift für Kristallographie. Crystalline Materials. Oct2025, p1. 6p. 2 Illustrations.

Subject Terms: *ALUMINUM compounds, *INTERMETALLIC compounds, *X-ray spectroscopy, *MAGNETIC susceptibility, *STRONTIUM titanate

Study on the mechanism of 6061-T6 Al and ZK61M Mg on FSLW joints: influence of overlapping order.

Authors: Wang, Jianzhou Sun, Yang Sun, Yibo et al.

Source: Journal of Adhesion Science & Technology. Oct2025, Vol. 39 Issue 20, p3116-3131. 16p.

Subject Terms: *SHEAR strength, *INTERMETALLIC compounds, *MICROSTRUCTURE, *FRICTION stir welding, *ALUMINUM alloys, *MAGNESIUM alloys, *WELDING

Phase engineering of monodispersed ternary Co/Mo2C/Co3Mo3N heterojunctions for efficient alkaline HER electrocatalysis.

Authors: Zeng, Zekai Zhang, Zixin Hu, Qi et al.

Source: Applied Physics Letters. 10/13/2025, Vol. 127 Issue 15, p1-9. 9p.

Subject Terms: *INTERMETALLIC compounds, *ELECTROCATALYSIS, *HETEROJUNCTIONS, *HETEROSTRUCTURES, *DENSITY functional theory

On the ambient conditions crystal structure of AgSbTe2.

Authors: Sun, Baihong Grazhdannikov, Sergei Dawod, Muhamed et al.

Source: Applied Physics Letters. 10/13/2025, Vol. 127 Issue 15, p1-6. 6p.

Subject Terms: *INTERMETALLIC compounds, *CRYSTAL structure, *RAMAN spectroscopy, *NUCLEAR magnetic resonance, *ELECTRIC fields

Synthesis of supported intermetallic nanoparticle catalysts using ball milling: a case of CoGe on carbon black.

Authors: Furuse, Atsuto Kojima, Takayuki

Source: Chemical Communications. 10/4/2025, Vol. 61 Issue 77, p14903-14906. 4p.

Subject Terms: *INTERMETALLIC compounds, *CATALYSTS, *GERMANIUM compounds, *CHEMICAL synthesis, *MECHANICAL alloying, *NANOPARTICLES, *CARBON-black, *CATALYTIC activity

Experimental and numerical investigation on bonding zone of Al foil/Cu composite prepared by explosive welding.

Authors: Wang, Junguo Wang, Cong Li, Mengyang et al.

Source: Archives of Civil & Mechanical Engineering (Elsevier Science). Oct2025, Vol. 25 Issue 5/6, p1-14. 14p.

Subject Terms: *ALUMINUM-copper alloys, *INTERMETALLIC compounds, *MICROSTRUCTURE, *COMPUTER simulation, *THERMAL properties, *EXPLOSIVE welding, *WELDING, *RECRYSTALLIZATION (Metallurgy)

Nanoscale ordering in PtCu3 nanowires: Low-temperature synthesis and structural characterization of the L12 phase.

Authors: Samantaray, Debadarshini Mondal, Suparna Mishra, Anupam

Source: Applied Physics A: Materials Science & Processing. Oct2025, Vol. 131 Issue 10, p1-11. 11p.

Subject Terms: *INTERMETALLIC compounds, *PHASE transitions, *CATALYTIC activity, *NANOSCIENCE, *MICROSTRUCTURE, *LOW temperature engineering, *STRUCTURAL analysis (Science)

Analysis of Grain Growth Behavior of Intermetallic Compounds on Plated Pure Sn for Micropump Solder Caps.

Authors: Park, Hwa-Sun Na, Chang-Yun Kim, Jong-Wook et al.

Source: Materials (1996-1944). Oct2025, Vol. 18 Issue 19, p4602. 18p.

Subject Terms: *INTERMETALLIC compounds, *SOLDER & soldering, *MICROPUMPS, *THERMOCYCLING, *METAL crystal growth, *SCANNING electron microscopy