Search Results - "[SPI.TRON] Engineering Sciences [physics]/Electronics"
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1
Authors: et al.
Contributors: et al.
Source: IEEE Transactions on Communications. 73:6156-6168
Subject Terms: Energy consumption, [SPI]Engineering Sciences [physics], [SPI] Engineering Sciences [physics], Wireless Sensor Network (WSN), Wi-Fi HaLow, IEEE 802.11ah, [SPI.TRON] Engineering Sciences [physics]/Electronics, [SPI.TRON]Engineering Sciences [physics]/Electronics, Internet of Things (IoT)
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2
Authors: et al.
Contributors: et al.
Source: Key Engineering Materials. 1023:1-6
Subject Terms: High voltage device, device simulation, high voltage, Bipolar diode, periphery protection, OBIC characterization, SiC-4H, [SPI.TRON] Engineering Sciences [physics]/Electronics, OBIC - Optical Beam Induced Current, [SPI.NRJ] Engineering Sciences [physics]/Electric power
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Access URL: https://hal.science/hal-04680725v1
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3
Authors: et al.
Contributors: et al.
Source: Key Engineering Materials. 1021:1-6
Subject Terms: High voltage device, 4H-SiC, High Voltage, Electrical Characterization, Bipolar Junction Transistor, Bipolar transistor, SiC-4H, [SPI.TRON] Engineering Sciences [physics]/Electronics, [SPI.NRJ] Engineering Sciences [physics]/Electric power
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4
Authors: et al.
Contributors: et al.
Source: 2025 International Symposium on Electromagnetic Compatibility – EMC Europe. :784-789
Subject Terms: [SPI.ELEC] Engineering Sciences [physics]/Electromagnetism, Intentional electromagnetic interference, Electromagnetic information security, Backscattering, Hardware Trojan, [SPI.TRON] Engineering Sciences [physics]/Electronics, [INFO.INFO-CR] Computer Science [cs]/Cryptography and Security [cs.CR]
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5
Authors: et al.
Contributors: et al.
Source: 2025 International Symposium on Electromagnetic Compatibility – EMC Europe. :739-744
Subject Terms: Q-factor, reverberation chamber, [SPI.TRON] Engineering Sciences [physics]/Electronics, electronic stirring, scattering parameters
File Description: application/pdf
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6
Authors: et al.
Contributors: et al.
Source: 2025 International Symposium on Electromagnetic Compatibility – EMC Europe. :1270-1275
Subject Terms: spatial correlation, [SPI.ELEC] Engineering Sciences [physics]/Electromagnetism, central limit theorem, standard deviation, effective sample size, Reverberation chamber, [SPI.TRON] Engineering Sciences [physics]/Electronics
File Description: application/pdf
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7
Authors: et al.
Contributors: et al.
Source: 2025 International Symposium on Electromagnetic Compatibility – EMC Europe. :1-6
Subject Terms: Equivalent coupling surface, Couplage mutuel, Power converters, Balayage en champ proche, [SPI.ELEC] Engineering Sciences [physics]/Electromagnetism, Near-field scan, Insertion loss, Atténuation d'insertion, Mutual coupling, Convertisseurs de puissance, Surface de couplage équivalente, [SPI.TRON] Engineering Sciences [physics]/Electronics, [SPI.NRJ] Engineering Sciences [physics]/Electric power
File Description: application/pdf
Access URL: https://laas.hal.science/hal-05245361v1
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8
Authors:
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Source: 2025 IEEE 31st International Symposium on Local and Metropolitan Area Networks (LANMAN). :1-6
Subject Terms: Dense networks, Vehicular communications, Physical layer, Beyond 5G (B5G), Cell-free massive MIMO (CF-mMIMO), Sixth-generation (6G), Frequency resource allocation, [SPI.TRON] Engineering Sciences [physics]/Electronics, Multi-subband system
File Description: application/pdf
Access URL: https://hal.science/hal-05062956v1
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9
Authors: et al.
Contributors: et al.
Source: ACM SIGEnergy Energy Informatics Review. 5:41-47
Subject Terms: CCS Concepts, • General and reference → Metrics, • Computing methodologies → Artificial intelligence Energy, Throughput computing, Reference works, • Information systems → Web services, ICT carbon footprint, CCS Concepts: Hardware → Interconnect power issues • Information systems → Web services • General and reference → Metrics Experimentation Reference works • Computing methodologies → Artificial intelligence Energy, [INFO] Computer Science [cs], Hardware → Interconnect power issues, Experimentation, [SPI.TRON] Engineering Sciences [physics]/Electronics
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10
Authors: et al.
Contributors: et al.
Source: IETE Technical Review. :1-35
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11
Authors: et al.
Contributors: et al.
Source: ACM Transactions on Embedded Computing Systems. 24:1-25
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12
Authors: et al.
Contributors: et al.
Source: ACM Transactions on Reconfigurable Technology and Systems. 18:1-22
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13
Authors: et al.
Contributors: et al.
Source: IEEE Transactions on Nuclear Science. 72:2368-2376
Subject Terms: Impact Ionization, Secondary Ion, [PHYS.NUCL] Physics [physics]/Nuclear Theory [nucl-th], [PHYS.NEXP] Physics [physics]/Nuclear Experiment [nucl-ex], Epitaxial Layer, Gate Oxide, Local Temperature, Specific Preparation, Failure Analysis, Single Event Effects, TCAD Simulation, Avionics, Silicon Carbide MOSFET, Heavy Ions, Energy-dispersive X-ray Spectroscopy, Neutron Energy, Catastrophic Events, Commercial Off-the-shelf, Breakdown Electric Field, Energy Dispersive X-ray, Silicon Carbide, High Electric Field, Specific Sample Preparation, Neutron Interactions, Pair Density, [SPI.TRON] Engineering Sciences [physics]/Electronics, Al Ions, Electric Potential Distribution, Silicon Carbide Power MOSFETs, Function Of Temperature, Scanning Electron Microscopy, Neutron Irradiation
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14
Authors: et al.
Contributors: et al.
Source: IEEE Transactions on Electromagnetic Compatibility. 67:1064-1073
Subject Terms: Time domain measurement, transmission (TDR &, TDT), Sparameters, Time domain reflectometry &, System level ESD, amp, [SPI.TRON] Engineering Sciences [physics]/Electronics
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15
Authors: et al.
Contributors: et al.
Source: IEEE Transactions on Industrial Electronics. 72:7595-7604
Subject Terms: Embedded control, embedded neural network, inductive power transmission (IPT), real-time parameters estimation, wireless power transmission (WPT), [SPI.TRON] Engineering Sciences [physics]/Electronics, [SPI.NRJ] Engineering Sciences [physics]/Electric power
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16
Authors: et al.
Contributors: et al.
Source: 2025 23rd IEEE Interregional NEWCAS Conference (NEWCAS). :401-404
Subject Terms: [SPI.TRON] Engineering Sciences [physics]/Electronics
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17
Authors: et al.
Contributors: et al.
Source: 2025 IEEE 101st Vehicular Technology Conference (VTC2025-Spring). :1-5
Subject Terms: [SPI] Engineering Sciences [physics], [SPI.OTHER] Engineering Sciences [physics]/Other, IoT, LoRa/LoRaWAN, energy consumption, [SPI.TRON] Engineering Sciences [physics]/Electronics
Access URL: https://hal.science/hal-05003218v1
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18
Authors:
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Source: 2025 IEEE Vehicular Networking Conference (VNC). :1-8
Subject Terms: frequency resource allocation, sixth-generation (6G), User-centric cell-free massive MIMO (UC CFm-MIMO) frequency resource allocation sixth-generation (6G) vehicular communications physical layer, vehicular communications, User-centric cell-free massive MIMO (UC CFm-MIMO), physical layer, [SPI.TRON] Engineering Sciences [physics]/Electronics
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Access URL: https://hal.science/hal-05011230v1
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19
Authors: et al.
Contributors: et al.
Source: Proceedings of the 22nd ACM International Conference on Computing Frontiers: Workshops and Special Sessions. :91-94
Subject Terms: Life cycle assessment, piezoresistive sensors, eco-design, smart insoles, electronics, eco-optimization, motion analysis, wearable sensors, smart cloth, environmental impacts, [SPI.TRON] Engineering Sciences [physics]/Electronics
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20
Authors: et al.
Contributors: et al.
Source: Proceedings of the 22nd ACM International Conference on Computing Frontiers: Workshops and Special Sessions. :121-129
Subject Terms: [SDE] Environmental Sciences, Printed Circuit Board Assembly (PCBA), Dense Electronic Devices, Cut-off, Screening LCA, Global Warming Potential (GWP), Life Cycle Assessment (LCA), [SPI.TRON] Engineering Sciences [physics]/Electronics, [INFO.INFO-ES] Computer Science [cs]/Embedded Systems
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